CAVE3 Review
March 9-10, 2016
Component Reliability
- A Study of Damage Progression in MEMS Based Oscillator on Exposure to Harsh Environments
- Effect of EMC's on Reliability of Cu-Al Wirebond System Subjected to High Temp Storage Life
- Survivability Assessment of Fine Pitch Solder Joint Fuze Electronics on a Circular PCB Under Mechanical Shock Loads up to 50,000g
- A Comparison of Temp and Humidity Effects on Phosphor Converted LED Package and the Prediction of Remaining Useful Life with State Estimation
- CTFE
- DIC Based Investigation into the Effect of Aging on Thermal Cycling Reliability
- Novel Micro-CT Data Based Finite Element Modeling Technique
- High Strain Rate Mechanical Properties of SAC105 Lead Free Alloys at Very High Operating Temps
- Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temp
Connectors
- PIM Induced by Nonlinearity of RF Connectors
- Experimental Testing FEA Simulation of Axial Vibration Thresholds of Fretting in Electrical Connectors
- Impedance Measurement of Electrical Contact Subjected to Fretting
- Effect of Electrical Connector Degradation
- Whisker Research Thrust
Flip Chip
- Characterization of Doped SAC Solder Materials and Determination of Anand Parameters
- Effects of Aging and Silver Content on the Anand Constitutive Model for SAC Lead Free Solders
- Mechanical Characterization of SAC305 Lead Free Solder at Extreme High Temps
- MPC Based Finite Element Meshing Strategy for Thermal Cycling Simulation of PBGA Package
- Mechanical Characterization of Doped SAC Solders at High Temps
- Moisture Effects on Underfill Materials Including Preconditioning
- High Temp Creep Response of Lead Free Solders
- Aging Induced Evolution of the Cyclic Stress-Strain Behavior of Lead Free Solders
- Cyclic Stress-Strain Behavior of SAC305 Lead Free Solder: Effects of Aging, Test Temp, Strain Rate, and Strain Range
- Characterization of Moisture Properties and Moisture Induced Die Stresses for Flip Chip Packaging
- Characterization of Moisture Properties and Moisture Induced Die Stresses for Quad Flat Packages