CAVE³ > CAVE3 Reviews > Fall 2017

CAVE³ Review

Sept 6-7, 2017

Newsletter

Agenda

Director's Report

Flip Chip and Underfills

• Flip Chip and Underfills

Connectors and System Level Interconnects

• Connectors and System-Level Interconnects: Degradation and Wear Mechanisms

Component Reliability and Prognostic Health Management Systems

• Component Reliability and Prognostic Health Management Systems - I
• Component Reliability and Prognostic Health Management Systems - II

Harsh Environment Electronic Systems and Lead Free Soldering

• Harsh Environment Electronic Systems

Lead Free Soldering

• Lead Free Soldering