CAVE3 Review
September 13-14, 2006
Miscellaneous Posters
Lead Free Soldering
- Lead Free Soldering
- Interfacial Chemistry at Wetting for SAC 405 on HASL-Cu Board Finishes
- Wetting of SAC 405 Solder Paste to Sn-Cu Board Finishes
- Sessile Drop Formation for Sn-Ag-Cu-Bi Solder Paste on Sn-Cu Board Finishes
- Oxide Formation on Pb-Free Alloy Surfaces
- Isothermal Aging Effects on the Mechanical Properties of Lead-free Solders
- Temperature and Strain Rate Effects on Tensile Properties of Lead-free Solders
- Study on Microstructure Evolution and Mechanical Properties of SAC/Sn-Pb Mixed Formulation Solders
Harsh Electronics Systems and Manufacturing
- Harsh Electronics Systems and Manufacturing
- Capacitor Cracking Tests
- Overmolding for Harsh Environments
- 2512 Packaging Replacement
- Bottleneck Detection and Mitigation in Serial Production Systems
Flip-Chip and Underfills
- Flip Chip and Underfills
- RVE and RSA based Techniques for Non-Linear Properties of Nano-Underfills in Extreme Environment
- Effects of Environmental Exposures on the Mechanical Behavior of the Underfill Encapsulants
- The Effects of Cure Profile on Underfill Properties and Flip Chip Reliability
- Flip-Chip Process and Reliability
- Stress Measurements in Large Area Array Flip Chip Packages
- Real Time Die Stress Characterization in Flip Chip Assemblies Subjected to Thermal Cycling
- Calibration of Test Chips for Stress Measurement
- CTE Measurements of STABLCOR Carbon Fiber Reinforced Plys
Connector Reliability
- Connector Reliability
- Model Development and Validation for Vibration-Induced Fretting Corrosion
- Influence of Connector Contact Interface Forces on Tin Whisker Growth
- Influence of Plating Process Parameters on Whisker Formation from Pure Tin Electrodeposits
- Role of Surface Oxides on Sn Whisker Growth
- Influence of Surface Roughness on Sn Whisker Growth
- The Effect of Repeated Connector Insertions on Electrical Contact Resistance
Component Reliability
- Component Reliability
- Multi-variate Regression Methods for Selection of CBGA Packages For Extreme Environments
- Multi-variate Regression Methods for Selection of CCGA Packages For Extreme Environments
- Principal Components and Stepwise Regression Methods for Selection of Flip Chip Packages for Extreme Environments
- Implementation of the Material Database in CAVE Software Tools</a>
- Prognostics Health Management and Damage Relationships of Leaded and Lead-Free Devices in Harsh Environments
- Modeling Shock-Failures in Electronics Packaging
- Initiation and Progression of Failures during Shock in Electronics Packaging