CAVE3 Review
April 21-22, 2004
GPS and Inertial Sensors for Smart Vehicles
SMT Assembly Process
- Modeling and Control of SMT Assembly Processes Project
- Allocating Testing Efforts in a Radio Assembly Line
- Simulation Template for Modeling Electronics Assembly Lines
- Scheduling Production in a Serial Manufacturing Line
Lead Free Soldering
- Lead Free Soldering Project
- Interface Between Sn-4.0Ag-0.5Cu Solder Paste and Ni-Au During Wetting
- Auger Spectroscopy of Sn-3.5Ag Solder Paste Wetted to Ni-Au
- Thermal Cycling Reliability of Lead Free Chip Resistor Solder Joints
- Lead Free Radio Solder Joint Reliability Study
- Measurement of Lead Free Solder Mechanical Properties
- Effects of Thermal Aging on the Mechanical Properties of Lead Free Solders
Harsh Environment Electronics Systems
- Harsh Environment Electronic Modules Project
- Metal Backed Boards: Component Reliability and Analysis
- Virtual Profiling for Reflow Processes
- Thermal Performance of Metal Backed Substrates
- Thermal Resistance Measurement System
- Next Generation High Temperature Test Vehicles
Flip-Chip and Underfills
- Flip Chip on Laminate Project
- Flip Chip on Laminate: Process Development and Reliability
- Prediction of Mechanical Properties of Underfills
- Progress in Measurement of Underfill Material Behavior
- Measurement of Underfill Fracture Toughness
- Dynamic Mechanical Analysis (DMA) Testing of Flip Chip Underfills
- Stress and Delamination Measurements in Flip Chip Assemblies
Connectors
- Connector Project
- Fretting Corrision in an Automotive Connector
- A Fundamental Study of the Physical Characteristics of Vibration-Induced Fretting Corrosion
- Tin Whisker Growth on Lead Free Connector Pins
- Tin Whisker Study #2
- Tin Whisker Study #3
Component Reliability and Prognostic Health Management Systems
- Component Reliability Project
- BGA Thermal Performance During Reliability Testing
- Guidelines for the Selection and Design of Area Array Packages for Space Applications
- Online Engineering Simulation Tools
- Damage Mechanics of Electronics on Metal-Backed Substrates in Harsh Environments
- Leading Indicators-of-Failure for Prognosis of Electronic and MEMS Packaging
- Finite Element Simulation of Chip Resistor Solder Joint Reliability on Metal Backed Substrates