CAVE3 Review
March 8-9, 2006
Miscellaneous Posters
- GPS and Vehicle Dynamics CAVE Affiliate Member Projects
- Update on NSF REU and CSEMS Scholarship Activities
Lead Free Soldering
- Lead Free Soldering
- Interfacial Chemistry at Wetting for Sn-3.5Ag on Ag-Cu Board Finishes
- Sessile Drop Formation for Sn-0.7Cu Solder Paste on Ag-Cu Board Finishes
- Comparison of IMC Growth on Ultra-Smooth and Commercial Board Finishes Using Pb-Free Solders
- Isothermal Aging Effects on the Mechanical Properties of Lead-free Solders
- Temperature and Strain Rate Effects on Tensile Properties of Lead-free Solders
- Microstructural and Mechanical Investigations on SAC/SnPb Mixed Formulation Solders
Harsh Electronics System Reliability
- Harsh Electronics System Reliability
- Mixed Assembly Solder Joint Reliability for BGA Packaging
- QFN Reliability Testing
- Capacitor Cracking for Harsh Environment Electronics Applications
- MELF Package Reliability
- Assembly & Test for Large Lead-Free BGAs
- Sn-Cu-Ni Solder Paste Reliability
- Thermal Measurements During Battery Discharge
Flip-Chip and Underfills
- Flip Chip and Underfills
- Flip-Chip Process and Reliability
- Real Time Die Stress Characterization in Flip Chip Assemblies Subjected to Thermal Cycling
- Isothermal Aging Effects on the Mechanical Behavior of the Underfill Encapsulants
- CTE and Elastic Modulus Measurements of STABLCOR Carbon Fiber Reinforced Plys
Electronics Manufacturing
- Electronics Manufacturing
- A Multi-line and Multi-product Scheduling Support System
- Development of PCB Assembly Line Simulation Models Using the Electronics Manufacturing Template and Related Tools
- Simulation-based Analysis of Serial Production Systems
Connector Reliability
- Connector Reliability
- Modeling and Testing of Connector Fretting Degradation
- Influence of Press-Fit Insertion and Thermal Shock Induced Stresses on Tin Whisker Growth (Summary - Tin Whisker Study #3)
- Influence of Connector Contact Interface Forces on Tin Whisker Growth
- High-Resolution Auger Electron Spectroscopy of Sn Whiskers
Component Reliability
- Component Reliability
- Principal Components and Stepwise Regression Methods for Selection of Flip Chip Packages for Extreme Environments
- Roll-Out of CAVE Software Tools
- Prognostication and Health Monitoring of Leaded and Lead-Free Devices in Harsh Environments
- Statistical Pattern Recognition for Damage Initiation and Progression in Shock of Electronic Assemblies
- Explicit Submodeling Technique for Failure Prediction in Electronic Assemblies Subject to Shock and Drop Environment