CAVE3 Review
Sept 7-8, 2016
Flip Chip and Underfills
- Effects of Moisture on Underfill Materials Exposed to Different Humidity Conditions
- Characterization of Mechanical and Moisture Properties of Polymer Materials
- Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures
- Characterization of Moisture and Thermally Induced Die Stresses in Plastic Ball Grid Array Packages
- Characterization of Moisture Properties and Moisture Induced Die Stresses for Flip Chip Packaging
- Improved Finite Element Simulation Strategy for Detailed Modeling of Solder Joints in BGA Packages Subjected to Thermal Cycling
- Improved Multi-Point Constraint Based Meshing Strategy for Finite Element Modeling of BGA Packages
Harsh Environment Electronic Systems
Connectors and System Level Interconnects
Lead Free Soldering
- Creep Properties of SAC305 Solder Joints at Elevated Temperatures
- Aging Induced Evolution of the Cyclic Stress-Strain Behavior of Lead Free Solders
- Anand Model and FEA Predictions for Lead Free Solder Alloys Including Aging Effects
- Characterization of Doped SAC Solder Materials and Determination of Anand Parameters
- Evolution of the Cyclic Stress-Strain Behavior of Doped SAC Solder Materials Subjected to Isothermal Aging
- Mechanical Characterization of SAC 305 Lead Free Solder at High Temperature