CAVE3 Review
March 5-6, 2008
Miscellaneous Posters
Lead Free Soldering
- Lead Free Soldering
- Mechanical Behavior of Low Silver Content SAC Alloys Optimized For Portable Electronics
- The Influence of Aging Temperature and Silver Content on the Creep Properties of SAC Solder Alloys
- Creep Behavior of Mixed Formulation Solders
- Wetting of Alpha SAC0307 Alloy to Entek OSP
- Wetting of SAC105+Ni+Cr Alloy to Entek OSP
- Wetting of SACX+1%Bi Alloy to Entek OSP
- Wetting of SACX+2%Bi Alloy to Entek OSP
- Wetting of SACX+Ni+Cr Alloy to Entek OSP
- Effect of Shelf Life on Pb-Free Solder Alloy Wetting
- Pb-Free Alloy Surface Composition vs. Temperature for Bar and Exotic Alloys
Harsh Electronics Systems and Manufacturing
- Harsh Electronics Systems and Manufacturing
- Overview of Thermal Performance of Adhesives Research
- Reliability of Capacitor Plating Alternatives for Conductive Adhesive
- Double-Sided Reflow of Grid Array Packages with Via in Pad CSP
- Thermal Performance of Laminate to Aluminum Attachment Materials
- Systems Reliability of Module Overmolding Materials
- In-Situ Environmental Testing for Solder Joint Reliability: Alternative Metho
- Laminate Circuit Board Testing For Harsh Environment Applications
Flip Chip And Underfills
- Flip Chip and Underfills
- Overview of DPACK Research
- The Effects of Isothermal Aging on Underfill Stress-Strain Behavior
- Isothermal Aging Effects on Underfill Creep Behavior
- Thermo-Mechanical Reliability of Flip Chip Assemblies with Multilayer Underfills
- Characterization of Underfills for Microprocessor Packaging
- Characterization of an LCP Socket for Flip Chip Microprocessor Packaging
- Reliability Modeling of 3D Packages: DPACK Full-Interposer and Partial Interposer
- Thermal Cycling Reliability Testing of DPACK Test Boards
- DPACK Failure Analysis: Locations by Probing
- DPACK Failure Analysis: Optical Inspection Full Interposer
- DPACK Failure Analysis: Cross-Section Analysis - Partial Interposer
- DPACK Failure Analysis: Cross-Section Analysis - Full Interposer
Connector Reliability
- Connector Reliability
- Overview of Tin Whisker Projects
- Overview of Solenoid Valve Reliability Research
- Hydraulic Solenoid Valve Reliability and Modeling Study
- Whisker Growth from Various Sputtered Metals Deposited on Brass
- Influence of Applied External Stress on Sn Whisker Growth
- Electrical Contact Resistance Considering Multi-Scale Roughness
- Thermally Driven Fretting Modeling
- Three Dimensional Model Refinement for Vibration-Induced Fretting Corrosion
- Thermal Analysis of Automotive Batteries
Component Reliability
- Component Reliability
- Multiple Linear Regression Models for Copper Core PBGAs Subjected to Harsh Environments
- Wear Simulation in Electrical Contacts in 3D Embedded Modules
- Interrogation of System State for Damage Assessment in SAC105, SAC305, SAC405, and SAC0307 Electronics Subjected to Thermo-Mechanical Loads
- Prognostic Health Management for Prior Damage Assessment of Sn3.5Ag, Sn0.3Ag0.7Cu0.1Bi, Sn0.2Ag0.7Cu0.1Bi0.1Ni Electronics Under Thermo-Mechanical Loads
- Thermo-Mechanical Models and Reliability Data for High I/O Area-Array Packaging
- Thermo-Mechanical Reliability of Ceramic Area Array Components
- Spectral Analysis Using Feature Extraction for Electronics Subjected to Transient Loads
- CAVE Online Simulation Tools