CAVE3 Review
October 20-21, 2004
SMT Assembly Process
- Modeling and Control of SMT Assembly
- Allocating Testing Efforts in a Radio Assembly Line
- A Simulation Study of A Proposed PCB Manufacturing Line For Siemens VDO Automotive
- A Decision Support System for Scheduling Production in a Serial Manufacturing Line
Miscellaneous Posters
- Manufacturing Engineers for the Automotive Sector (MEAS) Scholarships
- Introduction to New NSF Funded Project on Drop/Impact Reliability of Electronics
Lead Free Soldering
- Lead Free Soldering Project
- Isothermal Growth of Intermetallic Compounds in Pb-Free Solder Alloy Systems
- Interfacial Chemistry at Wetting for Sn-4.0Ag-0.5Cu Solder Paste on Pd-Ni
- Real-Time Wetting Dynamics of Sn-3.5Ag Solder Paste on Pd-Ni
- Lead Free Radio Solder Joint Reliability Study
- Effects of Aging on the Mechanical Properties of Lead Free Solders
Harsh Environment Electronics Systems
- Harsh Environment Electronic Modules Project
- TV3D Reliability Testing Charles Mitchell (ISE)
- Thermal Performance of Metal Backed Substrates Yasser Elkady (ME)
Flip-Chip and Underfills
- Flip Chip on Laminate Project
- Flip Chip on Laminate: Process Development and Reliability Guoyun Tian (CAVE)
- Effect of Filler Size on the Material Properties Of Underfill Saiful Islam (ME)
- Temperature Dependent Material Behavior of Underfills Saiful Islam (ME)
- Material Characterization and Flip Chip Die Stress Measurement Utilizing a Low-Expansion PCB Laminate for Space or Extreme Environments
- Stress Characterization in Large Die Flip Chip Assemblies
Connector Reliability
- Connector Project
- A Study of the Physical Characteristics of Vibration-Induced Fretting Corrosion
- Tin Whisker Growth on Lead Free Connector Pins due to Thermal Shock Induced Stresses (Tin Whisker Study #2)
- Influence of Press-Fit Insertion and Thermal Shock Induced Stresses on Tin Whisker Growth (Tin Whisker Study #3)
Component Reliability and Prognostic Health Management Systems
- Component Reliability Project
- BGA Thermal Performance During Reliability Testing
- Guidelines for the Selection and Design of Area Array Packages for Space Applications
- CAVE Online Simulation Tools
- Damage Mechanics of Electronics on Metal-Backed Substrates in Harsh Environments
- Methodology For Prognostication Of Electronics And MEMS Packaging
- Simulation of Chip Resistor Reliability on Metal Backed Substrates
- IMC and Phase Growth Behavior Of Sn/Pb Solder During Isothermal Aging
- Lead Free Solder Joint Reliability And Crack Propagation Studies
- Shock and Drop-Impact Reliability Prediction for SnPb and SnAgCu Solder Fine-Pitch BGAs and CSPs