CAVE3 Review
September 16-17, 2011
Director's Report: Center Overview & Status
Vehicle Survivability Analysis
Component Reliability and Prognostic Health Management Systems
- Component Reliability and Prognostic Health Management Systems
- High Strain Rate Properties and Life Prediction Models for SnAgCu Leadfree Electronics under Shock-Impact
- De-correlated Feature Space and Neural-Net Based Framework for Failure Models Clustering in Electronics Subjected to Mechanical-Shock
- Simultaneous Multiple Stress Environment Test Vehicle for SnPb and Lead Free Assemblies
- Prognostic Health Management E-Tool
- Thermo-mechanical Reliability and Thermal Performance for the HEV Metal Matrix System
- Join Discussion on the CAVE3 Blog
- Life Assessment of Pb-free Electronics Under Simultaneous Temperature and Vibration Loading
- Effect of Reflow on Glass Transition Temperature of FR-4
- Thermal Characterization of Copper Graphite Composite
- High G-Level Testing of Micro-Coil Spring Interconnects
- Interrogation of Accrued Damage and Remaining Life in Field-Deployed Electronics Subjected to Multiple Thermal Aging and Thermal Cycling
- Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Influence of Silver Content for Lead Free Electronics
- Line Spring Modeling for of Lead-Free Solder Alloys under Transient Dynamic Framework
- Extended Kalman Filter Based Models for Prognostication of Remaining Useful Life
- IGBT Module Thermal and Reliability Re-Design
- Package on Package Test Vehicle Assembly for Drop and Shock Reliability Evaluation
Chip-Level Interconnects, Flip-Chip and Underfills
- Chip-Level Interconnects, Flip-Chip and Underfills
- 3D Viscoelastic Model for Underfill Material Behavior
- Implementation of Viscoelastic Models for Underfill in Finite Element Analysis
- Development of Lamination Theory for STABLCOR Substrates
- FEA Predictions of Die Stresses in Microprocessor Assemblies Subjected to Temperature Change and Thermal Cycling
- Effect of Heat Sink Clamping on Die Stresses in Microprocessor Packages
- Effect of BGA Solder Balling on Microprocessor Die Stress .
Harsh Electronics Systems and Manufacturing
- Harsh Environment Electronics Systems
- Aging Effects on Reliability of Leadfree Solder for Temperature Accelerated Life Testing (TV7)
- Reliability of aged lead-free solder for mechanical accelerated life testing (TV7)
- Reliability for micro BGA packages (TV8)
- Reliability of Wafer Level Lead Free Flip Chip for Thermal Accelerated Life Testing
Connectors, and System-Level Interconnects
- Connectors, and System-Level Interconnects: Degradation and Wear Mechanisms
- Modeling of Vibration Damping in Microfibrous Material
- Sn Whisker Growth from Sputtered Sn63/Pb37 Film on Brass
- P11-301: SnOx Growth on Sn Metal Surfaces
- Effect on Whisker Growth of Topside Ni Thin Films
- A study of Various Material Combinations on the Bolted Contacts of Busbars
Lead Free Soldering
- Leadfree Solders Alloys Constitutive and Wetting Behavior
- Reduction of Lead Free Solder Aging Effects Using Doped SAC Alloys
- Aging Induced Microstructure Evolution of Doped Lead Free Solders
- Aging Induced Relaxation of Residual Stresses in Lead Free Solders
- Characterization of Hysteresis Loop Evolution in Aged Lead Free Solders
- Determination of Material Properties of Solder Joints by Nano-Indentation Testing
- Development and Construction of an Iosipescu Shear Test Fixture for Solders
- Effects of Aging on the Anand Constants for Lead-Free Solder Alloys
- Sensitivity of the Stress-Strain Behavior of Lead-Free Solders to Changes in the Anand Constants