CAVE3 Review
March 11-12 2009
Lead Free Soldering
- Lead Free Solder Alloys Constitutive and Wetting Behavior
- Extreme Low Temperature Mechanical Behavior of Solders
- Mechanical Behavior of Mixed Formulation Solders
- The Influence of Aging Conditions and Silver Content on the Mechanical Behavior of SAC Solders
- Creep Characterization of Low Silver Content SAC Solders
- Modeling of Aging and Creep of Lead free Solders
Harsh Electronics Systems and Manufacturing
- Harsh Electronics Systems and Manufacturing
- Module Overmolding for Harsh Environments
- Reliability Test for Harsh Environmental Connectors
- Harsh Environmental Reliability Test 3 for KEMET Capacitors
- In-Siu Environmental Testing for Solder Joint Reliability - Alternative Method (II)
- Thermal Performance of Laminate to Aluminum Attachment Materials
Flip Chip And Underfills
- Chip-Level Interconnects, Flip Chip and Underfills
- The Effects of Isothermal Aging on Underfill Stress-Strain Behavior
- Isothermal Aging Effects on Underfill Creep Behavior
- Die Stress Variation in Micro-Processor Packaging Subjected to Accelerated Testing
- Computational Evaluation of Die Stress in Mircoprocessor Packaging
- Determination of Stress Measurement Accuracy with Piezoresistive Sensors
- Physical Analysis of Stablcor Substrates
Connector Reliability
- Connectors and System-Level Interconnects: Degradation and Wear Mechanisms
- Modeling and Analysis of a Connector System for Vibration-induced Fretting Corrosion
- Multiphysics FEM Connector Model for 40A Connector
- Multiphysics FEM Model for 300 A Connector
- A Molecular Model of Asperity Contact and Comparison to Continuum Based Models with Emphasis on Lattice Orientation and Size
- Modeling Thermally Driven Fretting Corrosion
- Are We Really Draining the Swamp
- Studies of POSS Short-Stop Conformal Coating Tin Whisker Suppressant
- Growth of Sn Whiskers on Ag Substrates
- Sn Whisker Growth vs Film Thickness
- 1Development of a Temperature-Cycling SEM Failure Analysis Tool
- Environmental System to Study Whiskering
- Theoretical and Experimental Investigation on Fretting Corosion and Thermal Degradation for Hybrid and Electric Vehicles
Component Reliability
- Component Reliability and Prognostic Health Management Systems
- PCR Component Analysis Based Development of Norris-Landzberg Acceleration Factors and Goldman's Constants for Lead free Electronics
- Condition Monitoring of Hi-Rel Systems under Dynamic Loads
- Prognostication of Latent Damage and Residual Life in Lead free Electronics Subjected to Multiple Thermal-Environments
- Thermo-mechanical Models and Reliability Data for High I/O Area-Array Packages
- Thermo-mechanical Reliability of Advanced Interconnects:Micro-pearl SOL, SAC305, Copper Columns
- Thermo-mechanical Reliability of Low-Silver Leadfree Alloys
- Cohesive Zone Models for Area-Array Packages
- Acceleration Factors and Life Prediction Models for on-chip and off-chip Failure Mechanisms
- Shock Models for Advanced Interconnect Area-Array Ceramic Packages
- Thermo-mechanical Reliability Model for 1206 Resistor Solder Joint
- Health Monitoring Schemes for Electronics Subjected to Drop and Shock