CAVE3 Review
March 6-7, 2013
- Assembly of New CBGA Test Vehicle
- Characterization of Microprocessor Die Stress During Power Cycling
- Effect of Heat Sink Clamping on Die Stresses in Microprocessor Packages
- Effect of Moisture on Encapsulants
- FEA Predictions of Die Stresses in CBGA Assemblies
- Flip Chip and Underfills
- Componet Reliability
- Effect of High Strain Rate and Aging on Material Characterization of Innolot
- Effect of High Strain Rate on Mechanial Properties of SAC105 and SAC305 Leadfree Alloys
- Experimental Thermal Testing of IGBT Module For DRS
- High G Shock Reliability of MEMS Accelerometers
- Life Prediction Methodology For High Power Luxeon LEDs
- Methodology For High Temperature Vibration Fatigue Life Prediction of SAC305
- Numerical Thermal Analysis of IGBT Module for DRS
- PHM of LED with the Measurement of Foward Voltage and Forward Current
- Physics Parameter Based Statistics Models for Warpage Prediction
- Prognostics Framework to Assess Operational Readiness of Electronics
- Prognostics of Damage Accrual in SSL Luminaries and Drivers Subjected to HTSL Accelerated Aging
- Sustained Damage and Remaining Useful Life Assessment
- A Study of Various Material Combinations on the Bolted Contacts of Busbars
- Connector Reliability
- Exploring Structure Zone Space for Sputtered SN Films
- Growing Tree Rings on SN Whiskers
- Influence of Hydrogen Incorporation on SN Whiskering
- Mitigation of the Effects of High Power High Frequency Acoustic Noise on MEMS Gyroscopes
- Threshold of Axial Vibration Induced Fretting in Electrical Connectors
- Aging Effects on Reliability of Leadfree Solder for Temperature Accelerated Life Testing
- Harsh Electronics Systems and Manufacturing
- Reliability of Aged Leadfree Solder for Mechanical Accelerated Life Testing
- Reliability Study on Isothermally Aged Doped Lead Free Solders
- Effect of Aging on the Cyclic Stress Strain Behavior and Fatigue Life of Leadfree Solders
- Effect of Solidification Profile on the Anand Model Parameters for Leadfree Solders
- Effects of Aging on the Anand Viscoplastic Constitutive Model for SAC Solders
- FEA Analysis of the Effects of Solidification Profile on BGA Thermal Cycling Reliability Solder Joint
- Nanomechanical Characterization of SAC Solder Joints Aging and Orientation Effects
- Predictions of Thermal Cycling Life of PBGA Components Using Aging Included Reliability Model