CAVE3 Review
September 14-15, 2005
Lead Free Soldering
- Lead Free Soldering
- Interfacial Chemistry at Wetting for Sn-3.0Ag-0.5Cu on Ag-Cu Board Finishes
- Real-Time Sessile Drop Formation for Sn-3.4Ag-1.0Cu-3.3Bi Solder Paste on Ag-Cu
- Preparation of Ultra-Smooth Surface Finishes for IMC Growth Using Pb-Free Solders
- Evolution of Lead-Free Solder Mechanical Properties During Isothermal Aging
Harsh Electronics System Reliability
- Harsh Electronics System Reliability
- BGA Component Reliability of SAC/SnPb Solder Mix
- QFN Reliability Testing
- Tin-Copper-Nickel Solder Joint Reliability
- PC Board Qualification: Thermal Cycling of Large PCBs After Multiple Reflows
Flip-Chip and Underfills
- Flip Chip and Underfills
- Flip-Chip Process and Reliability
- Nano-Underfill for Flip-Chip Applications in Extreme Environment
- Effects of Isothermal Aging on the Mechanical Behavior of Underfill
- Ultra-High Reliability Flip Chip on Laminate for Harsh Environments
Electronics Manufacturing
- Electronics Manufacturing
- Productivity Analysis of a FCM Assembly Line
- Simulation Modeling and Analysis of PCB Manufacturing Lines
Connector Reliability
- Connector Reliability
- The Influence of Fundamental Connector Characteristics on Vibration-Induced Fretting Degradation
- Modeling of Vibration-Induced Fretting in Electrical Connectors
- Effect of Thermal Shock on Tin Whisker Growth in Bent Connector Pins
- Influence of Press-Fit Insertion and Environmental Exposure on Tin Whisker Growth
- Reproducibility of Whisker Growth vs. Film Stress State for Sn on Brass
Component Reliability
- Component Reliability
- Design Guidelines for Selection of Flip Chip Packages for Extreme Environments
- CAVE Software Tools
- Prognostication and Health Monitoring of Leaded and Lead-Free Devices in Harsh Environments
- Statistical Pattern Recognition for Damage Initiation and Progression in Shock of Electronic Assemblies
- Explicit Submodeling Technique for Failure Prediction in Electronic Assemblies Subject to Shock and Drop Environment