CAVE3 Review
October 22-23, 2002
Introduction to AU Information Technology Peak of Excellence
SMT Assembly Process
- Modeling and Control of SMT Assembly Processes Project
- Modeling And Control of a Surface Mount Assembly Process
- Allocating Solder-Paste Printing Inspection In High Volume Electronics Manufacturing
- A Heuristic Approach To Generating A Multi-Stage Inspection Plan For A Serial Assembly Line
Lead Free Soldering
- Lead Free Soldering Project
- Surface Reactions of Sn-3.3Ag-4.8Bi Solder Alloy Wetted to Ni-Au
- Microstructural Characterization of Lead Free Solders Subjected to Thermal Cycling
- Lead Free Solder Joint Reliability Studies
- Measurement Of Lead Free Solder Material Behavior
High Temperature Electronics
- High Temperature Electronics Project
- Flip Chip on Ceramic Reliability Testing
- Thermal Performance of Interface Materials
Flip-Chip and Underfills
- Flip Chip on Laminate: Process Development and Reliability
- Flip Chip on Laminate Project
- Progress in Measurement of Underfill to Soldermask Adhesion
- Measurement of Underfill Material Behavior
- Plane Stress Fracture Properties Of Underfill Materials
- Flip Chip Stress And Delamination Measurements
Correlation of Field Life with Accelerated Life Testing Project
- Part 1
- Part 2
- Part 3
- Part 4
- Correlation of Field Life with Accelerated Life Testing Project
- Outreach to Middle Schools
Connector Reliability
- Connector Project
- Vibration Thresholds for Fretting Corrosion in Electrical Connectors
- Testing of Lead-Free Connector Finishes
- Connector and Switch Cyclic Testing
- Tin Whisker Growth on Lead Free Connector Pins
- Large Diameter Wire Bonding
BGA Reliability
- BGA Reliability Project
- Reliability of Small BGAs in the Automotive Environment
- TV-2 Failure Analysis Of Underfilled BGAs
- Metal-Backed Substrates Test Vehicle Program
- BGA Thermal Performance
- TV-3a Thermal Testing
- Apparatus for Thermal Resistance Measurement of Flat Samples
- TV-3B Thermal Cycling Reliability