CAVE3 Review
March 9-10, 2011
Director's Report: Center Overview & Status
Vehicle Survivability Analysis
Component Reliability and Prognostic Health Management Systems
- Component Reliability and Prognostic Health Management Systems
- Ridge Regression Based Development of Norris- Landzberg Acceleration Factors and Goldmann's’s Constants for Lead free Electronics
- Linear Spring Modeling of Leadfree Alloys under Transient Dynamic Loads
- Kalman Filter Based Models for Prognostication of Remaining Useful Life
- Prognostic Health Management eTool
- Prognostication of BGA Health Using Resistance Spectroscopy
- Join Discussion on the CAVE3 Blog
- Simultaneous Multiple Stress Environment Test Vehicle for SnPb and Lead Free Assemblies
- Finite Element Models for Reliability Evaluation of NASA-MSFC Micro-Coil Spring and IC Packages
- Effect of Isothermal Aging on the Reliability of Pb-free Solder Interconnects Subjected to Drop and Shock
- Package-on-Package Test Vehicle Design
- Life-Prediction Models for SnAgCu Leadfree Electronics under Shock-Impact
- Fault-Isolation Framework In Electronics Under Mechanical Shock
- Fault-Mode Isolation in Electronic Systems Under Mechanical Shock by Unsupervised Linear Projection Scheme
- Interrogation Of Accrued Damage And Remaining Life In Field-deployed Electronics Subjected To Multiple Thermal Environments Of Thermal Aging And Thermal Cycling
- Thermo-mechanical reliability and Thermal performance for the HEV Metal Matrix System
- Effect of Process Variables on Glass Transition Temperature of FR-4
- Al/SiC as an IGBT Heat Sink Material
- Thermal Characterization of Copper Graphite Composite
Connectors, and System-Level Interconnects
- Connectors, and System-Level Interconnects: Degradation and Wear Mechanisms
- Whisker Growth in the Presence of Thermal Sn Oxide Surface Layers
- Effect on Whisker Growth of Topside Ni Thin Films
- The Underwater Effects of High Power, High Frequency Acoustic Noise on MEMS Gyroscope
- Modeling and Analysis of an Alternative Connector System Design for the Prediction of Vibration-induced Fretting Degradation
Flip-Chip and Underfills
- Chip-Level Interconnects, Flip-Chip and Underfills
- Development of Lamination Theory for STABLCOR Substrates
- Development of a Viscoelastic Model for Underfill Mechanical Behavior
- Characterization and Modeling of Die Stress During Heat Sink Clamping
- FEA Predictions of Die Stresses in Microprocessor Assemblies Subjected to Temperature Change
- Determination of Anand Constants from Creep Test Results for SAC Solder
Harsh Electronics Systems and Manufacturing
- Harsh Environment Electronics Systems
- Aging Effects on Reliability of Leadfree Solder for Temperature Accelerated Life Testing (TV7)
- Reliability of aged lead-free solder for mechanical accelerated life testing (TV7)
- Reliability for micro BGA packages (TV8)
- Report for the Reliability Test in Auburn University