CAVE3 Review
April 27-28, 2005
Miscellaneous Posters
Lead Free Soldering
- Lead Free Soldering
- Interfacial Chemistry at Wetting for Sn-3.3Ag-4.8Bi on Pd-Ni Board Finishes
- Real-Time Wetting Dynamics for Sn-3.4Ag-1.0Cu-3.3Bi Solder Paste on Pd-Ni
- Problems in Measuring Isothermally Grown Intermetallic Compounds on Highly-Reactive Ni-Au Board Finishes
- Evolution of Lead-Free Solder Mechanical Properties During Isothermal Aging
Harsh Electronics System Reliability
- Harsh Electronics System Reliability
- Reliability of Lead Free BGAs with SnPb Paste
- Reliability of QFNs with Simultaneous Current & Power
- PC Board Qualification with Alternate Plating Option
Flip-Chip and Underfills
- Flip Chip and Underfills
- Nano-Underfills for High Reliability Application in Harsh Environments
- Fundamentals if Delamination Initiation and Growth in Flip Chip Assemblies
- Packaging Stress Characterization at Low Temperatures
- Ultra-High Reliability Flip Chip on Laminate For Harsh Environments
- Flip Chip on Laminate: Process Development And Reliability
Electronics Manufacturing
- Electronics Manufacturing
- A Feeder Replenishment Policy Using Dynamic Programming
- Application of the PCB Manufacturing Template for Analysis of Manufacturing
Connector Reliability
- Connector Reliability
- The Influence of Contact Interface Characteristics on Vibration-Induced Fretting Degradation
- Effect of Thermal Shock on Tin Whisker Growth in Connector Pins due to Bending Induced Stresses
- Effect of Thermal Cycling on Tin Whisker Growth in Connector Pins due to Bending Induced Stresses
- Influence of Press-Fit Insertion and Environmental Exposure on Tin Whisker Growth
- Growth Mechanism of Sn Whiskers
Component Reliability
- Component Reliability
- Prognostication and Health Monitoring of Leaded and Lead Free (LF) Electronic and MEMS Packages in Harsh Environments
- Simulation of Thermo-Mechanical Reliability of BGAs for Space Application
- Design Guidelines for Selection of Area-Array Packages for Extreme Environments
- Online Simulation Tools for Component Reliability
- Shock and Drop-Impact Reliability Prediction for SnPb and SnAgCu Solder Fine-Pitch BGAs and CSPs