CAVE3 Review
March 31 - April 1
Hybrid Electric Vehicle Systems and Components
Vehicle Survivability Analysis and Experimentation
Lead Free Soldering
- Lead Free Solder Alloys Constitutive and Wetting Behavior
- 100% In-Situ Studies of Mixed Formulation Alloy Wetting
- Microstructure Evolution of Mixed Formulation Alloys
- Preliminary Study of Aging And Dopants on Mechanical Properties of SAC Solders
- Effects of Aging on Tensile Properties of SACX
- Modeling of SAC Solder Behavior Using the Anand Viscoplastic Model
- Initial Study of SAC Cyclic Stress-Strain Behavior And Hysteresis
- Mechanical Characterization of Solders at Cyrogenic Temperatures
- Modeling of Stress-Strain Behavior of Lead Free Solders
- The Influence Of Aging Conditions on the Mechanical Behavior of SAC Solders
Harsh Electronics Systems and Manufacturing
- Harsh Electronics Systems and Manufacturing
- In-Situ Environmental Testing for Solder Joint Reliability - Alternative Method (III)
- Design, Processing and Reliability Characterizations of a 3D-WLCSP Packaged Component
- Measurement of Thermal Properties of an Epoxy/Alumina Composite
- Task Complexity Measurement and Video Training for Automated Equipment
- Reliability of aged lead-free solder for mechanical accelerated life testing (TV7)
- QFP Reliability on Powered and Non-Powered Thermal Cycle Environment
- Reliability of aged lead-free solder for temperature accelerated life testing (TV7)
- Dip flux reliability for micro BGA packages (TV8)
Flip Chip And Underfills
- Chip-Level Interconnects, Flip Chip and Underfills
- Creep Characterization And Modeling of Underfills For Microprocessor Packaging
- Test Plan For Flip Chip on Laminate Die Stress Study
- Determination of Stress Measurement Accuracy With Piezoresistive Sensors
- Isothermal Aging Effects On Underfill Creep Behavior
- Isothermal Aging Effects On Underfill Stress-Strain Behavior
- FEA Predictions Of Assembly Induced Die Stresses In Microprocessor Packaging
- Effects of Heat Sink Clamping on Changes in the Microprocessor Die Stress
- Die Stress Variation in Microprocessor Packaging Subjected to Long Term Thermal Cycling
- Temperature Dependent Die Stresses in Microprocessor Packaging
- Development Of Lamination Theory For STABLCOR Substrates
- Progress on CBGA Component Assembly and Packaging
Feedback
Connector Reliability
- Connectors and System-Level Interconnects: Degradation and Wear Mechanisms
- Multiphysics/Mutliscale Finite Element Model - 40A Connector
- Mitigation of Sn Whisker Growth Using a Ni Underlayer
- Sn Whisker Growth from Sputtered SAC 305 Film on Brass
- Sn Whiskers Formed in Electric Fields
- Whisker Exoskeletons as Viewed by Real-Time Scanning Electron Microscopy
- Whisker Growth During Exposure to Controlled Humidity
- Experimental Investigation Of 300amp Connectors
- Simulation and Experimental Study on the Influence of Particulate Contaminants on Vibration-Induced Fretting Corrosion
- Combining Thermal And Vibrational Models To Analyze Fretting Corrosion
- Multi-Physics FEA with Multiscale Properties For High Power Connectors
- Vibration Based Interfaces for Information Transmission
Component Reliability and Prognostic Health Management Systems
- Component Reliabiltiy and Prognostic Health Management Systems
- Board Trace Fatigue Models for Electronics Under Shock-Impact
- Acceleration Factors and Life Prediction Models for On-Chip and Off-Chip Failure Mechanisms
- PCR and Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics
- Anomaly Detection and Fault Isolation Schemes in Electronic Systems Subjected to Drop and Shock
- Prognostics Framework to Access Operational Readiness of BGA's for Re-Deployment in Thermo-Mechanical Environments
- Thermo-mechanical Solder Joint Reliability and Thermal Performance for the Hybrid Electronic Vehicle System
- Study of Crack Initiation & Propagation in different type of Lead-free packages subjected to Multiple Thermal Environments
- Thermo-Mechanical Reliability of Low-Silver Lead Free Solder Alloys
- Prediction of Transient Dynamics and Interface Damage for SnAgCu Leadfree Electronics Under Shock-Impact
- Join the Discussion on the CAVE3 Blog
- Prognostic Health Management E-Tool
- Assessment of PHM Algorithm Robustness for Electronics Applications
- Vibration Testing of MSFC Ceramic Area Array Micro Coil Spring
- Life-Prediction Models for SnAgCu Leadfree Electronics under Shock-Impact
- CAVE3 Online Simulation Tools
- Decision Framework for Redeployment of Electronics in Multiple Environments based on Damage Precursors