CAVE3 Review
Sept 10-11, 2014
Flip Chip
- Effects of Moisture Exposure on Flip Chip Underfills
- Moisture Effects on Underfill Materials Including Preconditioning
- Characterization of Moisture and Thermally Induced Die Stresses in Flip Chip on Laminate Assemblies
- Characterization of Microprocessor Die Stress in CBGA Test Assemblies
- Effect of Heat Sink Clamping on Die Stresses in Microprocessor Packages
- Characterization of Microprocessor Die Stress During Power Cycling
Component Reliability
- Mechanical Properties of SAC305 Operating at High Temperatures and High Strain Rates
- Diagnostic-Prognostic Sensing for Harsh In- Situ Testing
- Transient Dynamics Model and 3D-DIC Analysis of New-Candidate for JEDEC JESD22-B111 Test Board
- Discoloration Analysis and Color Shift of LED Package Under Contaminated Harsh Environment
- Life Prediction and Classification of Failure Modes in Solid State Luminaires Using Bayesian Probabilistic Models
- Development of Crack Growth Model for SAC105 and SAC305
- Damage Pre-Cursor Based Life Prediction of the Effect of Mean Temperature of Thermal Cycle on the SnAgCu Solder Joint Reliability
- Closed-Form Life Prediction for Assessment of Aging Effects on Thermal Fatigue Reliability of Leadfree Alloys
- FMU- 143 Electrical Testing
- MEMS Reliability Testing ADXL193
- WHTOL Accelerated Aging 60W Equivalent LED Light Bulb
- Reliability of Solid-State Lighting Electrical Drivers Subjected to WHTOL Accelerated Aging
- Non-Destructive Crack and Defect Detection in SAC Solder Interconnects Using Cross-Sectioning and X-Ray Micro-CT
- HAST Reliability of Cu-Al Wirebond System
- Degradation Mechanisms in Electronic Mold Compounds Subjected to High Temperature in Neighborhood of 200C
- Reliability of MEMS Devices Under Multiple Environments
- High Strain Rate Mechanical Properties of SAC105 Lead Free Alloys at High Operating Temperatures
- Simultaneous Temperature & Vibration Reliability of Electronic System
- Ion Transport and Corrosion Modeling in Molded Cu-Al Packages
Connector Reliability
- AMPM Connector Testing
- Effects of Connector Failure on Communication System Reliability
- The Effect of Sand on the Wear of Anodized Aluminum Surfaces
- Observing Whisker Growth in Real Time
- Effect on Whiskering of Controlled Bismuth Additions to Sputtered Sn Films
- Modeling and Simulation of Missile Launcher System Wear During Captive Carry
Harsh Environments
- Aging Effects on Reliability of Lead Free Solder for Temperature Accelerated Life Testing (TV7)
- Reliability Study on Isothermally Aged Doped Lead-Free Solders for Accelerated Life Testing
Lead Free Solders
- Characterization of New Doped SAC Solder Materials: 'Ecolloy' and "Cyclomax'
- FEA Modeling of 15 MM BGA Components That Include Aging Effects
- The Effects of Aging on the Anand Viscoplastic Constitutive Model for SAC305 Solder
- The Effects of Aging and Silver Content on the Anand Viscoplastic Constitutive Model for Lead Free Solders
- Fatigue Life of SACN05 Lead Free Solders
- Comparison of Uniaxial and Nanoindentation Creep Data Including Aging Effects
- Nano-Mechanical Characterization of SAC Solder Joints: Reduction of Aging Using Doped Alloys
- Effects of Aging on the Fatigue Behavior of Lead Free Solders
Vehicle Survivability Analaysis
Presentations
- Flip Chip and Underfills
- Pb-Free Soldering
- Harsh Environment Electronics Systems
- Connectors, and System-Level Interconnects: Degradation and Wear Mechanisms
- Component Reliability and Prognostic Health Management Systems
- High Strain Rate SAC Properties at High and Low Operating Temperatures
- Simultaneous Temperature & Vibration Reliability of Electronic Systems