CAVE3 Review
March 7-8, 2012
Connectors, and System-Level Interconnects
- Connectors, and System-Level Interconnects: Degradation and Wear Mechanisms
- Axial Vibration Thresholds for Fretting Corrosion in Electrical Connectors
- Characterization of Damping Microfibrous Material
- Sound Attenuation Using MEMS Fabricated Acoustic Metamaterials
- The influence of Connector Lubricants on Shock Induced Discontinuities in Electrical Connectors
- Sundry Results From Past but Ongoing Whisker Studies
- What Really Prevents Whisker Penetration?
- Is a Surface Oxide Necessary to Whisker Growth?
Component Reliability and Prognostic Health Management Systems
- Component Reliability and Prognostic Health Management Systems
- Comparison of Kalman-Filter and Extended Kalman-Filter for Prognostic Health Management of Electronics
- Development of ANN Based Electronic Nose for Detection of H2, NH3, and Hydrazine
- High Strain Rate Solder and Interface Behavior
- High-G Level Testing of Micro-Coil Spring Interconnects
- IGBT Module Thermal and Reliability Re-Design for DRS
- Leading Indicators for Prognostic Health management of Electrical Connectors Subjected to Random Vibration
- Life Assessment of Pb-free Electronics Under Simultaneous Temperature and Vibration Loading
- Particle Filter Models and Phase Sensitive Detection for Prognostication and Health Monitoring of Lead-Free Electronics Under Shock and Vibration
- PIC Advanced Technologies Test Board 3 Testing at CAVE3
- Prognosticate Damage in Deployed Parts
- Redesign of the CAVE3 Website
- Self-Organized Mapping for Failure-Mode Classification
- Study of Crack Initiation & Propagation in Different Types of Lead-Free Packages Subjected to Multiple Thermal Environments
- Technology Transfer Project: PHM for John Deere Electrical Systems
- Thermal Characterization of FLEX PCB
- Thermo-mechanical Reliability and Thermal Performance for the Powerex IGBT Modules
- Electronics Survivability Analysis and Experimentation
Flip-Chip and Underfills
- Chip-Level Interconnects, Flip-Chip and Underfills
- Assembly of New CBGA Test Vehicle
- Characterization of Microprocessor Die Stress During Power Cycling
- Effect of Heat Sink Clamping on Die Stresses in Microprocessor Packages
- FEA Predictions of Die Stresses in Microprocessor Assemblies Subjected to Isothermal Aging and Power Cycling
- Initial Study of Biaxial Failure Criteria for Underfill
Harsh Electronics Systems and Manufacturing
- Harsh Environment Electronics Systems
- Aging Effects on Reliability of Lead-Free Solder for Temperature Accelerated Life Testing (TV7)
- ENGENT - WLCSP Assembly and Reliability Qualification Test
Lead Free Soldering
- Leadfree Solders Alloys Constitutive and Wetting Behavior
- Aging Effects on Grain Growth of Lead-Free Solders
- Aging Induced Microstructure Evolution and Residual Stress Relaxation of Lead Free Solder Alloys
- Determination of Material Properties of Lead-Free Solder Joints With Aging by Nanoindentation
- Evolution of the Tension/Compression and Shear Cyclic Stress Strain Behavior of Lead Free Solder Subjected to Isothermal Aging
- Modeling of Aging for Material Properties of Lead Free Solder Alloys
- Modified Anand Model for Lead Free Solder Alloys that Includes Aging Effects