CAVE3 Review
September 12-13, 2007
Lead Free Soldering
- Lead Free Soldering
- The Influence of Elevated Temperature Aging on the Reliability of Lead Free Solder Joints
- Wetting of Alpha SAC 105 to Entek Plus OSP with WS 600 Flux
- Wetting of Alpha SAC 305 to Entek Plus OSP with WS 600 Flux
- Wetting of Alpha SAC 405 to Entek Plus OSP with WS 600 Flux
- Wetting of Alpha SACX to Entek Plus OSP with WS 600 Flux
- Wetting of Alpha SACX+Ni to Entek Plus OSP with WS 600 Flux
- Wetting of Alpha SAC 405 to McDermid Ag-Cu with WS 600 Flux
- Wetting of Alpha SAC 405 to Photocircuits Ni-Au with WS 600 Flux
- Wetting of Alpha SAC 405 to Photocircuits Pd-Ni with WS 600 Flux
- Pb-Free Alloy Surface Composition vs Temperature, on Ag Surfaces
- Pb-Free Alloy Surface Composition vs Temperature, on Al Surfaces
- Pb-Free Alloy Surface Composition vs Temperature, on Cu Surfaces
- Pb-Free Alloy Surface Composition vs Temperature, on Ni Surfaces
- The Effects of Thermal Aging on the Creep Behavior of SAC305/405 Lead Free Solders
- Investigation of the Mechanical Behavior of SAC105 and SACX0307 Lead Free Solders
- Mechanical Behavior of Mixed Formulation Solders
Harsh Electronics System Reliability
- Harsh Electronics System Reliability
- Low Cost Thermal Enhancement for Enclosures (Radio)
- PCB Qualification Testing
- Alternative Component Termination for Electrically Conductive Adhesive
- Thermal Performance of PSA and Alternative Adhesives for Metal Backed FR4 and Polyimide Substrates
- Module Overmolding for Harsh Environments
Flip-Chip and Underfills
- Flip Chip and Underfills
- Microprocessor Area Array Flip Chip Packages
- The Effects of Isothermal Aging on Underfill Stress-Strain Behavior
- The Effects of Isothermal Aging on Underfill Creep Behavior
- Thermo-Mechanical Reliability of Flip Chip Assemblies with Multilayer Underfills
- Die Stress Variation During Thermal Cycling Reliability Tests
- Stress Measurements in Large Area Array Flip Chip Packages
- Characterization of Underfills for Microprocessor Packaging
- Socket Clamping Effects on Die Stresses in Microprocessor Packaging
Connector Reliability
- Connector Reliability
- Status of Fundamental Whisker Studies
- Electrical Connector and Solenoid Valve Modeling
- Model Refinement for Surface Roughness and Normal Force Influence on Vibration-Induced Fretting Corrosion
- Whisker Growth on Various Sputtered Metals Deposited on Brass
- Influence of Applied Stress on Whisker Growth
- Surface Separation and Contact Resistance Considering Elasto-Plastic Multi-Scale Rough Surface Contact
- The Influence of Surface Characteristics on Contact Resistance Levels
- Hydraulic Solenoid Valve Reliability
Component Reliability
- Component Reliability
- CAVE Online Simulation Tools
- Thermal Cycling Reliability Study of DPACK Test Boards
- Wear Simulation in Fuzz Buttons of Embedded 3D Modules
- Prognostics Health Management and Damage Relationship for Lead Free Components under Thermal Cycling Harsh Environment
- Leading Prognostic Indicators for Health Management of Electronics under Isothermal Thermo-Mechanical Stresses
- Thermo-Mechanical Reliability of Micropearl SOL
- Thermo-Mechanical Reliability of D-PAK using Finite Element Modeling
- Thermo-Mechanical Models for High I/O Area-Array Packaging
- Spectral Analysis using Feature Extraction for Electronics Subjected to Transient Loads
- Thermo-Mechanical Reliability Based Part Selection Models for Addressing Part Obsolescence in CBGA, CCGA, PBGA, FlexBGA, and Flip-Chip Packages