CAVE3 Review
October 29-30, 2003
Component Reliability and Prognostic Health Management Systems
- Component Reliability Project
- BGA Thermal Performance During Reliability Testing
- Guidelines for the Selection and Design of Area Array Packages for Space Applications
- Online Simulation Tools
- BGA TV3C Thermal Cycling Reliability Modeling
- Solder (63/37) Phase Growth Model in Automotive Underhood Applications
- Optimum Damage Volume For BGA And CSP Modeling in Automotive Applications
Flip-Chip and Underfills
- Flip Chip on Laminate Project
- Flip Chip on Laminate: Process Development and Reliability
- Prediction of Mechanical Properties of Underfills
- Progress in Measurement of Underfill Material Behavior
- Measurement of Underfill Fracture Toughness
- Dynamic Mechanical Analysis (DMA) Testing of Flip Chip Underfills
- Flip Chip Die Stress Variations During Delamination Growth
Connector Reliability
- Connector Project
- Modeling Early Stage Fretting of Electrical Connectors Subjected to Sinusoidal and Random Vibration
- An Evaluation of The Contact Interface Performance of Two Lead-Free Connector Finishes
- Connector and Switch Cyclic Testing
- Tin Whisker Growth on Lead Free Connector Pins
- Tin Whisker Testing: Round 2
High Temperature Electronics
- High Temperature Electronics Project
- Metal Backed Boards: Component Reliability and Analysis
- Reflow Profiling: Virtual Profiling and Metal Back Substrates
- Thermal Performance of Metal Backed Substrates
- Simulation of Chip Resistor Solder Joint Reliability on Metal Backed Substrates
- Material Behavior of Adhesives for Metal-Backed Substrates
Lead Free Soldering
- Lead Free Soldering Project
- Identification and Growth of Intermetallic Compounds in Pb-Free Solder Alloy Systems
- Growth Kinetics and Diffusion Mechanisms for Pb-Free Intermetallics
- Microstructural Characterization of Lead Free Solders Subjected to Thermal Cycling
- Lead Free Solder Joint Reliability Studies
- Microstructure of Solder Mechanical Test Specimens
- Measurement of Lead Free Solder Material Behavior
SMT Assembly Process
- Modeling and Control of SMT Assembly Processes Project
- Performance Analysis of Radio Testing
- A Template for the Simulation of Electronics Manufacturing Systems
- Capacity Loss Analysis Due to Line Start-up and Shut-down Effects
- Statistical Analysis of Inter-arrival Times for Radio Assembly Line