Lead Free Solders

Lead free solder materials are widely used as interconnects in electronic assemblies. They are often subjected to different thermal exposures such as isothermal aging and/or thermal cycling during their service life in various applications such a well drilling, automotive power electronics, aerospace engines, and geothermal energy. Therefore, the evolutions of mechanical properties of lead-free solder joint materials subjected to different thermal exposure profiles are of great importance and need to be investigated.

Electronic packaging industries are focusing on the relability challenge in the automobile sector and smaller solder joints at other electronic devices. Efficient characteristics like light weight, high speed, and miniaturization are necessary for devices such as laptops, cell phones, digital cameras, automobiles, and others. For the sake of increased demand, smart device manufacturers are focusing on designing these devices to have an array of solder interconnects with reductions in pitch and height.

The reliability of electronic packages largely depends on the surrounding application and specific application of the devices. It can be compromised by early failure, which can be caused by thermal cycling, mechanical loading, and coefficient of thermal expansion mismatch, among others. Reliable solder joints under various thermal exposure profiles are a key enabler to achieving robust packages and high performance.

lead free creep range

Area-Leader

Dr. Jeffrey Suhling (Research Leader), Dr. Sa'd Hamasha (Research Leader), Dr. Michael Bozack (Research Leader)

Objectives

Investigate the Mechanical Behavior (Stress-Strain) Evolution of SAC+Bi Solder Material under Different Thermal Cycling Profiles
Investigate the Uniaxial Tensile Properties of SAC305 at Very High Temperatures (up to 200 °C) and Different Strain Rates
Compare the Mechanical Properties of SAC305 at Various Operating Temperatures and Aging Conditions to Examine Effect of and Storage to Very High Temperature
Determine Anand Model Parameters Using Experimental Results Experimental Results
Investigate the Correlation of Anand Viscoelastic Model and Experimental Results
Study the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders
Explore Microstructural Evolution of IMC Particles Due to High Temperature Aging
Study the drop shock relationship of matched lead-free solder joints compared to SnPb
Provide the Basic Constitutive Laws and Mechanical Properties of Different Lead Free Solder Materials for Use in Finite Element Reliability Simulations

Project Titles

P20-301 Fatigue Performance of Individual Lead-free Solder Joints
P19-302 Microstructural Evolution in Aging Lead Free Solders
P19-301 Effects of Thermal Cycling on the Material Behavior of Lead Free Solders
P18-104b: Reliability of Leadfree Solders in High Temperature Vibration in Automotive Environments
P17-302 High Temperature Tensile and Creep Behavior of Lead Free Solders

Posters

Effect of Prolonged Storage up to 1-Year on Anand Parameters for SAC105 Leadfree Alloys - Vikas Yadav (ME)
Investigation and Comparison of Aging Induced Microstructural Changes in SAC305 and SAC_Q Lead Free Solders - Jing Wu (ME), Jeffrey Suhling (ME)
High Temperature Aging Effects in SAC and SAC+X Lead Free Solders - Mohammad S. Alam (ME), KM Rafidh Hassan (ME), Jeffrey Suhling (ME)
A Comparative Study of the High Temperature Mechanical Behavior of Lead Free Solders - Mohammad S. Alam (ME), KM Rafidh Hassan (ME), Jeffrey Suhling (ME)
Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging - Abdullah Fahim (ME), Sudan Ahmed (ME), Jeffrey Suhling (ME)
Thermal Cycling Reliability of of Newly Developed Lead-Free Solders for Harsh Environments - Francy Akkara (ISE), Sa'd Hamasha (ISE)
Experimental Characterization of the Dependence of the Poisson's Ratio of Lead Free Solder on Temperature, Strain Rate, Solidification Profile, and Isothermal Aging - KM Rafidh Hassan (ME), Mohammad S. Alam (ME), Jeffrey Suhling (ME)
Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling - Kamrul Hasan (ME), Abdullah Fahim (ME), Jeffrey Suhling (ME)
Mechanical Behavior of SAC305 Lead Free Solder Joints under Thermal Cycling using Nanoindentation - Abdullah Fahim (ME), Kamrul Hasan (ME), Jeffrey Suhling (ME)
Evolution of the Microstructure of Lead Free Solder Materials Subjected to Both Aging and Mechanical Cycling - Md Mahmudur R. Chowdhury (ME), Mohd Aminul Hoque (ME), Jeffrey Suhling (ME), Sa'd Hamasha (ISE)
Effect of Test Temperature and Prior Aging on the Cyclic Stress-Strain Behavior of Lead-Free Solders - Mohammad Ashraful Haq (ME), Md Mahmudur R. Chowdhury (ME), Jeffrey Suhling (ME), Sa'd Hamasha (ISE)

Representative Recent Publications

Akkara, F., M. Abueed, A. Srinivasan, M. Belhadi, P. Vyas, S. Hamasha, J. Suhling, P. Lall, Thermal Cycling Reliability of Lead-Free Solder Alloys using Surface Mount Resistors Considering Aging, in Proceedings of the 20th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 954-959, June 1-4, 2021.

Jian, M., P. Vyas, X. Wei, M. Belhadi, S. Hamasha, J. Suhling, P. Lall, Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling, in Proceedings of the 20th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 991-998, June 1-4, 2021.

Hasan, K., A. Fahim, M. Al Ahsan, J.C. Suhling, P. Lall, Mechanical Property and Microstructure Evolution in SAC and SAC+X Lead Free Solders Exposed to Various Thermal Cycling Profiles, in Proceedings of the 2021 IEEE 71st Electronic Components and Technology Conference, pp. 868-876, June 1-July 4, 2021.

Hassan, KM, J. Wu, M.S. Alam, J.C. Suhling, P. Lall, Mechanical Behavior and Reliability of SAC+Bi Lead Free Solders with Various Levels of Bismuth, in Proceedings of the 2021 IEEE 71st Electronic Components and Technology Conference, pp. 937-945, June 1-July 4, 2021.

Haq, M.A., M.A. Hoque, J.C. Suhling, P. Lall, Effect of Bismuth Content on the Mechanical Cyclic Properties of SAC+Bi Lead Free Solders, in Proceedings of the 2021 IEEE 71st Electronic Components and Technology Conference, pp. 1797-1804, June 1-July 4, 2021.

Hoque, M.A., M.A. Haq, J.C. Suhling, P. Lall, Mechanical Behavior and Microstructure Evolution in Lead Free Solders Subjected to Mechanical Cycling at Elevated Temperatures, in Proceedings of the 2021 IEEE 71st Electronic Components and Technology Conference, pp. 2340-2347, June 1-July 4, 2021.

Lall, P., V. Yadav, J. Suhling, D. Locker, Low temperature high strain-rate material properties for SAC-Q leadfree alloys, in Proceedings of the 19th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1084-1099, July 21-23, 2020.

Lall, P., V. Yadav, J. Suhling, D. Locker, Effect of thermal aging on the evolution of Anand parameters for SAC105 leadfree alloys operating at cold temperatures down to -55°C, in Proceedings of the 19th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1106-1120, July 21-23, 2020.

Al Ahsan, M., K. Hasan, A. Fahim, J. Suhling, P. Lall, Effect of different thermal cycling profiles on the mechanical behavior of SAC305 lead free solder, in Proceedings of the 19th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1170-1179, July 21-23, 2020.

Hasan, K., A. Fahim, J. Suhling, S. Hamasha, S. Hamasha, P. Lall, Mechanical behavior evolution of SAC+Bi lead free solder exposed to thermal cycling, in Proceedings of the 19th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1180-1190, July 21-23, 2020.

Hassan, KM, M. Alam, J. Wu, J. Suhling, P. Lall, Isothermal aging dependent Anand parameters of SAC305 lead free solder at extreme high temperatures, in Proceedings of the 19th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1191-1200, July 21-23, 2020.

Fahim, A., K. Hasan, J.C. Suhling, P. Lall, Investigation on the Mechanical Behavior Evolution Occurring in Lead Free Solder Joints Exposed to Thermal Cycling, in Proceedings of the 2020 IEEE 70th Electronic Components and Technology Conference, pp. 1486-1495, June 3-30, 2020.

Hoque, M.A., M.A. Haq, M.M. Chowdhury, J.C. Suhling, P. Lall, Evolution of the Properties of SAC-Bi-Ni-Sb Lead Free Solder During Mechanical Cycling, in Proceedings of the 2020 IEEE 70th Electronic Components and Technology Conference, pp. 2048-2057, June 3-30, 2020.

Hoque, M.A., M.M. Chowdhury, S. Hamasha, J. Suhling, P. Lall, Evolution of the Mechanical Properties of Lead Free Solder Joints Subjected to Mechanical Cycling, in Proceedings of the 18th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 295-302, Las Vegas, NV, May 28-31, 2019.

Alam, M. KM Hassan, J. Suhling, P. Lall, Mechanical Characterization and Microstructural Evolution of SAC and SAC+X Lead Free Solders Subjected to High Temperature Aging, in Proceedings of the 18th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 319-328, Las Vegas, NV, May 28-31, 2019.

Hasan, K., A. Fahim, J. Suhling, S. Hamasha, P. Lall, Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling, in Proceedings of the 18th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1332-1341, Las Vegas, NV, May 28-31, 2019.

Lall, P., V. Yadav, J. Suhling, D. Locker, Reliability of Leadfree Solders in High Temperature Vibration in Automotive Environments, in Proceedings of the 18th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 566-585, Las Vegas, NV, May 28-31, 2019.

Chowdhury, M.M., M.A. Hoque, J. Suhling, S. Hamasha, P. Lall, Effects of Aging on the Damage Accumulation in SAC305 Lead Free Solders Subjected to Cyclic Loading, in Proceedings of the 18th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 724-733, Las Vegas, NV, May 28-31, 2019.

Hassan, KM, M. Alam, M. Basit, J. Suhling, P. Lall, Experimental Characterization of the Dependence of the Poisson’s Ratio of Lead Free Solder on Temperature, Strain Rate, Solidification Profile, and Isothermal Aging, in Proceedings of the 18th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1342-1353, Las Vegas, NV, May 28-31, 2019.

Fahim, A., K. Hasan, S. Ahmed, J.C. Suhling, P. Lall, Mechanical Behavior Evolution of SAC305 Lead Free Solder Joints under Thermal Cycling, in Proceedings of the 18th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 734-744, Las Vegas, NV, May 28-31, 2019.

Lall, P., T. Thomas, J. Suhling, K. Blecker, Prognostication of Accrued Damage and Impending Failure Under Temperature Vibration in Leadfree Electronics, in Proceedings of the 2019 IEEE 69th Electronic Components and Technology Conference, pp. 1815-1825, Las Vegas, NV, May 28-31, 2019.

Alam, M.S., KM Hassan, J.C. Suhling, P. Lall, High Temperature Aging Effects in SAC and SAC+X Lead Free Solders, in Proceedings of the 18th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 734-744, Las Vegas, NV, May 28-31, 2019.

Su, S., M.A. Hoque, M.M. Chowdhury, S. Hamasha, J.C. Suhling, J.L. Evans, P. Lall, Mechanical Properties and Microstructural Fatigue Damage Evolution in Cyclically Loaded Lead-Free Solder Joints, in Proceedings of the 2019 IEEE 68th Electronic Components and Technology Conference, pp. 792-799, Las Vegas, NV, May 28-31, 2019.

Ahmed, S. J. Suhling, P. Lall, Evaluation of Aging Induced Microstructural Evolution in Lead Free Solders Using Scanning Probe Microscopy, in Proceedings of the 17th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1062-1070, San Diego, CA, May 29-June 1, 2018.

Hassan, KM, J. Suhling, P. Lall, The Influence of Poisson's Ratio on the Reliability of SAC Lead Free Solder Joints, in Proceedings of the 17th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1207-1216, FSan Diego, CA, May 29-June 1, 2018.

Su, S., F. Akkara, M. Abueed, M. Jian, S. Hamasha, J. Suhling, P. Lall, Fatigue Properties of Lead-Free Doped Solder Joints, in Proceedings of the 17th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1243-1248, San Diego, CA, May 29-June 1, 2018.

Lall, P., V. Yadav, J. Suhling, D. Locker, Effect of Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature, in Proceedings of the 17th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1296-1308, San Diego, CA, May 29-June 1, 2018.

Alam, M., J. Suhling, P. Lall, A Comparative Study of the High Temperature Mechanical Behavior of Lead Free Solders, in Proceedings of the 17th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1314-1323, San Diego, CA, May 29-June 1, 2018.

Chowdhury, M.M., N. Fu, M.A. Hoque, S. Ahmed, J. Suhling, S. Hamasha, P. Lall, Effects of Mechanical Cycling on the Microstructure of SAC305 Lead Free Solder, in Proceedings of the 17th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1324-1332, San Diego, CA, May 29-June 1, 2018.

Akkara, F.J., C. Zhao, R. Alathamneh, S. Su, M. Abueed, S. Hamasha, J. Suhling, P. Lall, Effect of Solder Sphere Alloys and Surface Finishes on the Reliability of Lead-Free Solder Joints in Accelerated Thermal Cycling, in Proceedings of the 17th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1374-1380, San Diego, CA, May 29-June 1, 2018.

Hoque, M.A., M.M. Chowdhury, N. Fu, J. Suhling, S. Hamasha, P. Lall, Evolution of the Cyclic Stress-Strain and Constitutive Behaviors of Doped Lead Free Solders During Fatigue Testing, in Proceedings of the 17th IEEE Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1387-1395, San Diego, CA, May 29-June 1, 2018.

Ahmed, S. J. Wu, N. Fu, J.C. Suhling, P. Lall, Quantification and Modeling of Microstructural Evolution in Lead Free Solders During Long Term Isothermal Aging, in Proceedings of the 2018 IEEE 68th Electronic Components and Technology Conference, pp. 162-171, San Diego, CA, May 29-June 1, 2018.

Lall, P., V. Yadav, J. Suhling, D. Locker, Anand Parameters for Modeling Prolonged Storage on High Strain Rate Mechanical Properties OF SAC-Q Leadfree Solder at High Operating Temperature, in Proceedings of the 2018 IEEE 68th Electronic Components and Technology Conference, pp. 448-459, San Diego, CA, May 29-June 1, 2018.

Fahim, A., S. Ahmed, J.C. Suhling, P. Lall, Nanomechanical Characterization of Intermetallic Compounds in Lead Free Solder Joints, in Proceedings of the 2018 IEEE 68th Electronic Components and Technology Conference, p. 2353, San Diego, CA, May 29-June 1, 2018.

Publications

Reviews