Recent Conference Presentations
ITHERM 2021
SESSION M-1: CHARACTERIZATION OF POLYMERS
Session Chair: Hayden Carlton (University of Arkansas)
Interfacial Fracture Toughness of PCB/Epoxy Interfaces under Three Point and Four Point
Loading with Sustained High Temperature Exposure
Pradeep Lall (1), Aathi Pandurangan (1), Ken Blecker (2), Auburn University (1), US Army CCDC-AC (2)
Effect of Thermal Aging on the Interface Fracture Toughness of the PCB-UP Interface
Pradeep Lall (1), Padmanava Choudhury (1), Jaimal Williamson (2), Auburn University (1), Texas Instruments (2)
Degradation Mechanisms of Epoxy Molding Compound Subjected to High Temperature
Long Term Aging
Pradeep Lall (1), Yunli Zhang (1), Jaimal Williamson (2), Auburn University (1), Texas Instruments (2)
SESSION M-2: PROGNOSTICS AND HEALTH MANAGEMENT OF ELECTRONICS
Session Chairs: Jacek Nazdrowicz (Lodz University of Technology), Rainer Dudek (Fraunhofer ENAS)
SOH Modelling of Li-Ion Coin Cells Subjected to Varying C-Rates, Depths of Charge, Operating Temperatures and Custom Charge Profiles
Pradeep Lall (1), Ved Soni(1), Guneet Sethi (2), Kok Yiang (2), Auburn University (1), Amazon Labs (2)
Prognostic and RUL Estimations of SAC105, SAC305 and SnPb Solders under Different Drop and Shock Loads using Long Short-Term Memory (LSTM) Deep Learning Technique
Pradeep Lall (1), Tony Thomas (1), Ken Blecker (2), Auburn University (1), US Army CCDC-AC (2)
Feature Vector Identification and Prognostics of SAC305 PCBs for Varying G-Levels of Drop and Shock Loads
Pradeep Lall (1), Tony Thomas (1), Ken Blecker (2), Auburn University (1), US Army CCDC-AC (2)
SESSION M-3: THERMO-MECHANICAL ASSESSMENT
Session Chair: Sudan Ahmed (NXP Semiconductor)
Modeling of Effect of Underfill Properties on Flip Chip Bumps and Solder Balls of FCBGA Package in Automotive Underhood Applications
Pradeep Lall (1), Madhu Kasturi (1), Jeff Suhling (1), Jaimal Williamson (2), Auburn University (1), Texas Instruments (2)
Mechanical Property Evolution in SAC+Bi Lead Free Solders Subjected to Various Thermal Exposures
Mohammad Al Ahsan, Kamrul Hasan, Abdullah Fahim, Jeffrey Suhling, Pradeep Lall, Auburn University
SESSION M-4: MECHANICAL SHOCK AND VIBRATION
Session Chair: Rafidh Hassan (Auburn University)
Non-Perpendicular High-G Shock on Potted Fine Pitch Electronics Under Sustained High Temperature Aging
Pradeep Lall (1), Aathi Pandurangan (1), Jeff Suhling (1), John Deep (2), Auburn University (1), US AFRL (2)
Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C
Pradeep Lall (1), Mrinmoy Saha (1), Jeff Suhling (1), Ken Blecker (2), Auburn University (1), US Army CCDC-AC (2)
High Strain Rate Properties of SAC305 Alloy at Cold Temperatures Subsequent to 100°C Storage for Periods up to 120 Days
Pradeep Lall (1), Vishal Mehta (1), Jeff Suhling (1), Ken Blecker (2), Auburn University (1), 2US Army CCDC-AC (2)
High Strain Rate Properties of M758 Solder at Extreme Operating Temperatures
Pradeep Lall (1), Vishal Mehta (1), Jeff Suhling (1), Ken Blecker (2), Auburn University (1), US Army CCDC-AC (2)
Microstructural Study of Lead Free Solder Alloys Subjected to Mechanical Cyclic Loading Under Various Conditions
Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey Suhling, Pradeep Lall, Auburn University
SESSION M-5: POWER ELECTRONICS
Session Chair: Nazli Donmezer (Bogazici University)
Development of a test methodology to design an overnight charging profile to reduce the SOH degradation rate of Li-ion batteries
Pradeep Lall (1), Ved Soni (1), Scott Miller (2), Auburn University (1), NextFlex (2)
SESSION M-6: FLEXIBLE ELECTRONICS
Session Chairs: Abhijit Dasgupta (University of Maryland), Aathi Pandurangan (Auburn University)
Printed flexible LC filter using the micro-dispensing technique using silver conductive pasted and ECA for component attachment
Pradeep Lall (1), Jinesh Narangaparambil (1), Kyle Schulze (1), Scott Miller (2), Auburn University (1), NextFlex (2)
Study of Interface Strength of Flexible Encapsulation for FHE Applications
Pradeep Lall (1), Jinesh Narangaparambil (1), Weifeng Liu (2), Scott Miller (3), Auburn University (1), Flex International (2), NextFlex (3)
Electrically Conductive Adhesive Interconnections on Additively Printed Substrates
Pradeep Lall (1), Kartik Goyal (1), Kyle Schulze (1), Scott Miller (2), Auburn University (1), NextFlex (2)
Twist Reliability Assessment of Flexible Batteries in Wearable Applications
Pradeep Lall (1), Hyesoo Jang (1), Ved Soni (1), Scott Miller (2), Auburn University (1), NextFlex (2)
Folding Reliability of Flexible Batteries in Wearable Applications
Pradeep Lall (1), Hyesoo Jang (1), Ved Soni (1), Scott Miller (2), Auburn University (1), NextFlex (2)
SESSION M-7: AUTOMOTIVE ELECTRONICS
Session Chairs: Xiangfei Yu (Apple), Yuji Komatsu (ZF Japan Co Ltd), Patel Chandramech (Microsoft)
High Temperature-Vibration Reliability of SnAgCu Leadfree Assemblies in Automotive Environments
Pradeep Lall (1), Vikas Yadav (1), Jeff Suhling (1), David Locker (2), Auburn University (1), US Army CCDC-AvMC (2)
Evolution of Viscoelastic Properties of Underfills Exposed to High Temperature
Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Ed Davis, Auburn University
Reliability Assessment of Cu-Al WB under High Temperature and Voltage Bias
Pradeep Lall (1), Sungmo Jung (1), Varughese Mathew (2), Auburn University (1), NXP Semiconductor (2)
Investigation and Comparison of Aging Effects in SAC+Bi Solders Exposed to High Temperatures
Jing Wu, KM Rafidh Hassan, Mohammad Alam, Jeffrey Suhling, Pradeep Lall, Auburn University
SESSION M-8: MATERIAL CHARACTERIZATION
Session Chairs: SB Park (Binghamton University), Tony Thomas (Auburn University)
Fatigue Performance of Ball Grid Array Components at Elevated Temperature
Xin Wei, Minghong Jian, Mohamed Belhadi, Sa’d Hamasha, Jeff Suhling, Pradeep Lall, Auburn University
Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for QSAC10 and QSAC20
Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Auburn University
Low Operating-Temperature High Strain Rate Constitutive Behavior of SnAgCu Solder Alloys after Prolonged Storage at High Temperature
Pradeep Lall (1), Vikas Yadav (1), Jeff Suhling (1), David Locker (2), Auburn University (1), US Army CCDC-AvMC (2)
Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint
Mohamed El Amine Belhadi, Francy John Akkara, Mohd Aminul Hoque, Palash Pranav Vyas, Xin Wei, Andrii Shmatok, Sa’d Hamasha, Barton Charles Prorok, Jeff Suhling, Pradeep Lall, Auburn University
Prediction of Stress-Strain Behavior of Thermally Cycled SAC305 Solder Joints by Finite Element Modeling and Nanoindentation Characterization
Abdullah Fahim, Kamrul Hasan, Jeffrey Suhling, Pradeep Lall, Auburn University
Anand Parameters for Eutectic Tin-Bismuth Solder
Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey Suhling, Pradeep Lall, Auburn University
The Effect of Bismuth Content on Mechanical Properties of SAC+Bi Lead Free Solder Materials and Determination of Anand Parameters
KM Rafidh Hassan (1), Jing Wu (1), Mohammad Alam (1), Jeffrey Suhling (1), Pradeep Lall (1), Geon Hong Ryu (2),
Myunghwan Byun (2), Auburn University (1), Keimyung University (2)
SESSION M-9: COMPACT MODELING
Session Chairs: Jeff Suhling (Auburn University), Felix Hirth (Robert Bosch GmbH)
Thermal Cycling Reliability of Lead-Free Solder Alloys using Surface Mount Resistors Considering Aging
Francy Akkara, Mohammed Abueed, Arvind Srinivasan, Mohamed Belhadi, Palash Vyas, Sa’d Hamasha,
Jeffrey Suhling, Pradeep Lall, Auburn University
Micromechanical Modeling of SAC305: Homogenization and Effect of IMC Particles on Deformation Behavior
Debabrata Mondal, Jing Wu, Abdullah Fahim, Jeffrey Suhling, Pradeep Lall, Auburn University
SESSION M-10: SOLDER JOINT FATIGUE
Session Chairs: Sudan Ahmed (NXP Semiconductor), Bakhtiyar Mohammad Nafis (University of Arkansas)
Low Temperature Solder Interconnection of Surface Mount Devices with Additively Printed Pads on Flexible Substrates
Pradeep Lall (1), Kartik Goyal (1), Kyle Schulze (1), Scott Miller (2), Auburn University (1), NextFlex (2)
High Temperature High Strain Rate Properties of SAC305 with Effect of 100°C Storage for Prolonged Duration
Pradeep Lall (1), Vishal Mehta (1), Jeff Suhling (1), Ken Blecker (2), Auburn University (1), US Army CCDC-AC (2)
Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling
Minghong Jian, Palash Pranav Vyas, Xin Wei, Mohamed El Amine Belhadi, Sa’d Hamasha, Jeff Suhling, Pradeep Lall, Auburn University
Comparison of Thermal Cycling Induced Mechanical Property Evolutions in Bulk Solder and Solder Joints
Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey Suhling, Pradeep Lall, Auburn University
SESSION E-2: ADDITIVE MANUFACTURING
Session Chairs: Joe Alexandersen (University of Southern Denmark), Eric Dede (Toyota)
Interconnection of Passive Components using Printed Aerosol-Jet Traces
Pradeep Lall (1), Jinesh Narangaparambil (1), Kyle Schulze (1), Scott Miller (2), Auburn University (1), NextFlex (2)
Process Recipes for Additively Printed Copper-Ink Flexible Circuits using Direct Write Methods
Pradeep Lall (1), Jinesh Narangaparambil (1), Kyle Schulze (1), Curtis Hill (2), Auburn University (1), NASA MSFC (2)
Process Development for Printing Copper Conductible Ink on Flexible Substrates using Aerosol Jet Printing Technology
Pradeep Lall (1), Ved Soni (1), Curtis Hill (2), Auburn University (1), NASA Marshall Space Flight Center (2)
SESSION E-4: MEASUREMENT AND DIAGNOSTIC TECHNIQUES
Session Chairs: Georges Pavlidis (NIST), Jungwan Cho (Sungkyunkwan University)
Hydrostatic Calibration of the Piezoresistive Coefficients of 4H Silicon Carbide
Jun Chen, Jing Wu, Jeffrey Suhling, Richard Jaeger, Auburn University
SESSION E-6: MICRO AND NANOSCALE THERMAL TRANSPORT
Session Chairs: Zhe Cheng (HUST), Ronald Warzoha (United States Naval Academy)
Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study
Mohammad Motalab (1), Md Faiyaz Jamil (1), Md Sagir Al Mahmud Jony (1), Pritom Bose (1), Jeffrey Suhling (2),
Bangladesh University of Engineering and Technology (1), Auburn University (2)
Effect of Lamination Parameters and Mechanical Folding on Li-Ion Battey Capacity Deterioration and SOH Degradation Rate
Pradeep Lall (1), Ved Soni (1), Jinesh Narangaparambil (1), Scott Miller (2), Auburn University (1), NextFlex (2)
ECTC 2021
Professional Development Courses:
Additive Flexible Hybrid Electronics - Manufacturing and Reliability
Course Leader: Pradeep Lall - Auburn University
Session 19: Enhanced Reliability Characterization and Methodologies
Committee: Applied Reliability
Session Co-Chairs: Darvin R. Edwards (Edwards Enterprise Consulting, LLC), Pilin Liu (Intel Corporation)
Low-Temperature High Strain Rate Constitutive Behavior of Doped and Undoped SnAgCu Solder Alloys after Prolonged Storage at High Temperature
Pradeep Lall (1), Vikas Yadav (1), Vishal Mehta (1), Jeff Suhling (1), David Locker (2), Auburn University (1), US Army Combat Capabilities Development (2)
Session 20: Reliability of Automotive Electrification and Autonomous Electronic Components
Committee: Applied Reliability
Session Co-Chairs: Tz-Cheng Chiu (National Cheng Kung University), Vikas Gupta (ASE US, Inc)
Mechanical Property and Microstructure Evolution in SAC and SAC+X Lead Free Solders Exposed to Various Thermal Cycling Profiles
SM Kamrul Hasan, Mohammad Al Ahsan, Abdullah Fahim, Jeffrey C. Suhling, Pradeep Lall, Auburn University
Session 21: Advances in Interconnect Reliability
Committee: Applied Reliability
Session Co-Chairs: Donna M. Noctor (Nokia), Scott Savage (Medtronic Microelectrics Center)
Mechanical Behavior and Reliability of SAC+Bi Lead Free Solders with Various Levels of Bismuth
KM Rafidh Hassan, Jing Wu, Mohammad S. Alam, Jeffrey C. Suhling, Pradeep Lall, Auburn University
Session 22: Advanced Package Modeling and Reliability
Committee: Applied Reliability joint with Thermal/Mechanical Simulation & Characterization
Session Co-Chairs: Wei Wang (Qualcomm Technologies, Inc.), Sandy Klengel (Fraunhofer Institute for Microstructure of Materials and Systems)
Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year
Pradeep Lall, Yunli Zhang, Madhu Kasturi, Padmanava Choudhury, Haotian Wu, Jeff Suhling, Ed Davis, Auburn University
Session 30: Package to System Level Thermo-Mechanical Reliability Modeling
Committee: Thermal/Mechanical Simulation & Characterization
Session Co-Chairs: Tieyu Zheng (Microsoft Corporation), Suresh K. Sitaraman (Georgia Institute of Technology)
Life Prediction of Thin Flexible Batteries under U-Flex-to-Install, Dynamic Folding, Dynamic Twisting and Battery Lamination
Pradeep Lall (1), Ved Soni (1), Jinesh Narangaparambil (1), Hyesoo Jang (1), Scott Miller (2), Auburn University (1), NextFlex National Manufacturing Institute (2)
Session 33: Flexing and Warpage Characterization and Modeling
Committee: Thermal/Mechanical Simulation & Characterization
Session Co-Chairs: Xuejun Fan (Lamar University), Erdogan Madenci (University of Arizona)
Flexible Encapsulation Process-Property Relationships for Flexible Hybrid Electronics
Pradeep Lall (1), Padmanava Choudhury (1), Jinesh Narangaparambil (1), Scott Miller (2), Auburn University (1), NextFlex National Manufacturing Institute (2)
Session 38: Reliability Analysis of New Materials in Modern Packaging
Committee: Interactive Presentations
Session Co-Chairs: Jeffrey Lee (iST-Integrated Service Technology Inc.), Mark Eblen (Kyocera International SC)
Effect of Bismuth Content on the Mechanical Cyclic Properties of SAC+Bi Lead Free Solders
Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall, Auburn University
Session 46: Student Session
Committee: Interactive Presentations
Session Co-Chairs: Alan Huffman (Micross Advanced Interconnect Technology), Ibrahim Guven (Virginia Commonwealth University)
Mechanical Behavior and Microstructure Evolution in Lead Free Solders Subjected to Mechanical Cycling at Elevated Temperatures
Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall, Auburn University