Additive Printed Flexible Hybrid Electronics (FHE)
Additively printed electronics are being increasingly explored in the realm of electronics manufacturing. Additive printed circuits have found their way into various aspects of manufacturing starting from achieving reliable traces to multi-layer circuits with micro-via, and now surface mount devices. Different technologies have their merits and demerits based on the conductive material properties, substrate, and the printer's capability to incorporate multiple materials simultaneously. Printed electronics are rapidly increasing and competing with traditional ways of manufacturing electronics. Different aspects of the processes are already being taken over in order to avoid material wastage and reduce costs and and lead times. For example, printing technologies are very popular in depositing reliable and very fine conductive traces. Authors have developed process studies by using Aerosol Jet Printing technology in realizing multi-layer metallization with successive metal and dielectric layers and additively printing a donut micro-via. Additionally, the assembly of Surface Mount Devices (SMD) on flexible substrates also has recently been of interest to researchers. In many formulations, additive print methods on low temperature substrates may not be compatible with traditional surface-mount processes. Newer low temperature interconnection methods and novel packaging architectures enabled through additive processes are being developed. The conductive traces are printed for interconnection to devices producing lower inductance interconnects and the dielectric is printed using using selective print processes.
Area-Leader
Dr. Pradeep Lall (Research Leader)
Posters
Electrically Conductive Adhesive Interconnections on Additively Printed Substrates - Kartik Goyal (ME)
Factors Influencing the Line Consistency of Commonly Used Geometrics for Additively Printed Electronics - Kartik Goyal (ME)
Method for Assessment of Folding-Reliability of Flexible Electronics in Wearable Applications - Hyesoo Jang (ME)
Effect of Sintering temperature on the Fatigue life of Additively Printed Electronics during cyclic bending - Jinesh Narangaparambil (ME)
Effect of Use Parameters on Fatigue-Life of Flexible Substrate under Bending Loads - Jinesh Narangaparambil (ME)
Factors Influencing the Line Consistency of Commonly Used Geometrics for Additively Printed Electronics - Kartik Goyal (ME)
Method for Assessment of Folding-Reliability of Flexible Electronics in Wearable Applications - Hyesoo Jang (ME)
Effect of Sintering temperature on the Fatigue life of Additively Printed Electronics during cyclic bending - Jinesh Narangaparambil (ME)
Effect of Use Parameters on Fatigue-Life of Flexible Substrate under Bending Loads - Jinesh Narangaparambil (ME)
Representative Recent Publications
Electrically Conductive Adhesive Interconnections on Additively Printed Substrates, Lall, P., J. Narangaparambil, K. Schulze, and S. Miller, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, pp. 807-817, June 1-4, 2021.
Low Temperature Solder Interconnection of Surface Mount Devices with Additively Printed Pads on Flexible Substrates, Lall, P., K. Goyal, K. Schulze, and S. Miller, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, pp. 972-980, June 1-4, 2021.
Interconnection of Passive Components using Printed Aerosol-Jet Traces, Lall, P., J. Narangaparambil, K. Schulze, and S. Miller, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, pp. 1052-1060, June 1-4, 2021.
Process Recipes for Additively Printed Copper-Ink Flexible Circuits using Direct Write Methods, Lall, P., J. Narangaparambil, K. Schulze, and C. Hill, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, pp. 1061-1072, June 1-4, 2021
Flexible Encapsulation Process-Property Relationships for Flexible Hybrid Electronics, Lall, P., P. Choudhury, J. Narangaparambil, and S. Miller, in Proceedings of the IEEE Electronic Components and Technology Conference, pp. 1490-1499, June 1-July 4, 2021.
Life Prediction of Thin Flexible Batteries under U-Flex-to-Install, Dynamic Folding, Dynamic Twisting and Battery Lamination, Lall, P., V. Soni, J. Narangaparambil, H. Jang, and S. Miller, in Proceedings of the IEEE Electronic Components and Technology Conference, pp. 1334-1345, June 1-July 4, 2021.
Twist Reliability Assessment of Flexible Batteries in Wearable Applications, Lall, P., H. Jang, V. Soni, and S. Miller, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, pp. 818-827, June 1-4, 2021.
Folding Reliability of Flexible Batteries in Wearable Applications, Lall, P., H. Jang, V. Soni, and S. Miller, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, pp. 828-835, June 1-4, 2021.
Process Development for Printing Copper Conductible Ink on Flexible Substrates using Aerosol Jet Printing Technology, Lall, P., V. Soni, and C. Hill, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, pp. 1073-1084, June 1-4, 2021.
Effect of Lamination Parameters and Mechanical Folding on Li-Ion Battey Capacity Deterioration and SOH Degradation Rate, Lall, P., V. Soni, J. Narangaparambil, and S. Miller, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, pp. 1257-1261, June 1-4, 2021.
Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition, Lall, P., H. Jang, C. Hill, and L. Creel, in Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, pp. 1-8, October 27-29, 2020.
Twist Reliability Assessment of Flexible Battery in Wearable Applications, Lall, P., H. Jang, and S. Miller, in Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, pp. 1-8, October 27-29, 2020.
Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates, Lall, P., V. Soni, and S. Miller, in Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, pp. 1-11, October 27-29, 2020.
Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink, Lall, P., J. Narangaparambil, V. Soni, and S. Miller, in Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, pp. 1-11, October 27-29, 2020.
Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology, Lall, P., K. Goyal, and S. Miller, in Proceedings of the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020), pp. 1-11, October 27-29, 2020.
Reliability of Additively Printed Traces on Polymer Substrates Subjected to Mechanical Stretching, Lall, P., Goyal, K., Leever, B., Miller, S., Proceedings of the IEEE 2019 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, pp. 1-6, May 28-31, 2019.
Factors Influencing the Line Consistency of Commonly Used Geometries for Additively Printed Electronics, Lall, P., Goyal, K., Leever, B., Miller, S., Proceedings of the IEEE 2019 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, pp. 1-7, May 28-31, 2019.
Capacity Degradation of Flexible Li-Ion Power Sources Subjected to Shallow Discharging, Lall, P., Abrol, A., Soni, V., Leever, B., Miller, S., Proceedings of the IEEE 2019 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2019), Las Vegas, NV, pp. 1-8, May 28-31, 2019.
Effect of Use Parameters on Fatigue-Life of Flexible Substrates under Bending Loads, Lall, P., Narangaparambil, J., Leever, B., Miller, S., Proceedings of the IEEE 2019 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2019), Las Vegas, NV, pp. 1-10, May 28-31, 2019.
Method for Assessment of Folding-Reliability of Flexible Electronics in Wearable Applications, Lall, P., Jang, H., Leever, B., Miller, S., Proceedings of the IEEE 2019 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2019), Las Vegas, NV, pp. 1-6, May 28-31, 2019.
Effect of Sintering Temperature on the Fatigue life of Additively Printed Electronics during Cyclic Bending, Lall, P., Narangaparambil, J., Leever, B., Miller, S., Proceedings of the IEEE 2019 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2019), Las Vegas, NV, pp. 1-9, May 28-31, 2019.
Effect of Shallow Charging on Flexible Power Source Capacity Subjected to Varying Charge Protocols and C-Rates, Lall, P., Soni, V., Abrol, A., Leever, B., Miller, S., Proceedings of the IEEE 2019 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2019), Las Vegas, NV, pp. 1-6, May 28-31, 2019.
Effect of Charging Cycle Elevated Temperature Storage and Thermal Cycling on Thin Flexible Batteries in Wearable Applications, Lall, P., A. Abrol, B. Leever, S. Miller, Proceedings of the IEEE 2019 Electronic Components and Technology Conference (ECTC 2019), Las Vegas, NV, pp. 1-12, May 28-31, 2019.
Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics, Lall, P., H. Zhang and R. Lall, in Proceedings of the ASME Interpack 2017, California, pp. 1-10 , August 29 – September 1, 2017.
Study on the Effect of Fixtures on Deformation and Warpage of the Double-Sided Flexible Printed Circuit Board through Reflow Using DIC, Lall, P., and K. Goyal, in Proceedings of the 16th ITherm, Orlando, Fl, pp. 1306-1314, May 30 – June 2, 2017.