Component Reliability and PHM
Structural health monitoring techniques are usually used as non-destructive techniques for identifying the stability of electronic systems. The major techniques used for this include built-in self-test, which conducts tests on functionality, use of auxiliary devices, which provides warnings before before the critical component's failure, and the use of fuses and canaries. These systems have their advantages in identifying failure of components, but also have disadvantages in predicting or monitoring the condition of the system during operation. Common examples of structural health monitoring are carried out in infrastructural projects in which different sensors are used to monitor the condition by using statistical and machine learning methods.
Significant fields that also use condition and health monitoring techniques involve aerospace structural stability analysis, health monitoring of offshore drilling equipment, condition modeling of civil structures with varying load and time, and in disciplines such as biology, medicine, and psychology. The most useful techniques used for feature vector identification and structural health monitoring involve statistical analysis, particularly related to pattern recognition, and decision boundary detection algorithms, with machine learning techniques with neural networks, and artificial intelligence. Previous work in health monitoring from strain signals involves the use of frequency components of the signals combined with the use of statistical techniques to identify the different feature vectors in predicting failure.
Area-Leader
Dr. Pradeep Lall (Research Leader)
Project Titles
- P18-102 PHM of Electronic Systems under Simultaneous Temperature and Vibration
- P18-103 System Models for High-G Survivability and Reliability
- P18-106 SOC Modeling of Power Sources
- P18-102a Sensitivity of Sensor-Location and Use Conditions on the Detectability of Accrued Damage for PHM under
Combined Temperature Vibration - P18-107a 3-D Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion
- P20-102a RUL Estimations of SAC305 Solder PCBs under Different Conditions of Temperature and Vibration Loads
Posters
- Damage for PHM under Combined Temperature Vibration - Tony Thomas (ME)
- Sensitivity of Sensor and Use Conditions on the Detectability of Accrued Damage for PHM under Combined Temperature Vibration - Tony Thomas (ME)
- Estimation of Acceleration Factor for Flexible Electronic Substrates from Human Motion Measurements - Tony Thomas (ME), Vikas Yadav (ME), Jinesh Narangaparambil (ME), Pradeep Lall (ME)
- Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCBs under Shock Loads up to 10,000g - Tony Thomas (ME), Pradeep Lall (ME)
Representative Recent Publications
Lall, P., T. Thomas, and K. Blecker, Prognostic and RUL Estimations of SAC105, SAC305 and SnPb Solders under Different Drop and Shock Loads using Long Short-Term Memory (LSTM) Deep Learning Technique, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 644-658, San Diego, CA, June 1-4, 2021.
Lall, P., T. Thomas, and K. Blecker, Feature Vector Identification and Prognostics of SAC305 PCBs for Varying G-Levels of Drop and Shock Loads, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 659-669, San Diego, CA, June 1-4, 2021.
Lall, P., J. Wei, X-ray Micro-CT and DVC Based Analysis of Strains in Metallization of Flexible Electronics, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1253-1261, Orlando, FL, May 30-June 2, 2017.
Lall, P., J. Wei, Remaining Useful Life Assessment of Field Deployed Electronics Using X-Ray Micro-CT Based Digital Volume Correlation and Finite-Element Analysis, in Proceedings of the IEEE Electronic Components and Technology Conference, pp. 1583-1592, Las Vegas, NV, May 31-June 3, 2016.
Lall, P., Deshpande, S., Nguyen, L., ANN Based RUL Assessment of Copper-Aluminum Wirebonds Subjected to Harsh Environments, Proceedings of the IEEE PHM Conference, Ottawa, Canada, pp. 1-10, June 20-22, 2016.
Lall, P., Dornala K., Suhling, J., Lowe, R., Foley, J., Life Prediction and RUL Assessment of Fine Pitch Solder Joint Fuze Electronics Under Mechanical Shock Loads Up To 50,000g, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 232- 244, May 31- June 3, 2016.
Lall, P., Deshpande, S., Nguyen, L., Prognostication of Cu-Al WB System Subjected to High Temperature-Humidity Condition, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 887- 898, May 31- June 3, 2016.
Lall, P., J. Wei, K. Dornala, R. Lowe, and J. Foley, Prognostication of Solder Joint Reliability of 0.4mm and 0.5mm Pitch BGAs Subjected to Mechanical Shocks up to 10,000G, in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1-8, Austin, TX, 2015.
Lall, P., Lowe, R., Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Reliability Under Vibration, ASME Journal of Electronic Packaging, Volume 136, No. 4, doi:10.1115/1.4028163, pp. 1-8, December 2014.
Lall, P., Lowe, R., Goebel, K., Prognostic Health Monitoring for a Micro-Coil Spring Interconnect Subjected to Drop Impacts, IEEE International Conference on Prognostics and Health Management, Gaithersburg, MD, pp. 1-11, June 24-27, 2013.
Lall, P., Lowe, R., Goebel, K., Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact, ASME J. Electron. Package. 134, 021001-1 to 021001-10, 2012.
Lall, P., Gupta, P., Goebel, K., Decorrelated Feature Space and Neural Nets Based Framework for Failure Modes Clustering in Electronics Subjected to Mechanical Shock, IEEE Transactions on Reliability, Vol. 61, No. 4, pp. 884-900, December 2012.
Lall, P., Gupta, P., Angral, A., Anomaly Detection and Classification for PHM of Electronics Subjected to Shock and Vibration, IEEE Transactions On Components, Packaging And Manufacturing Technology, DOI: 10.1109/TCPMT.2012.2207460 , Vol. 2, No. 11, pp. 1902-1918, 2012.
Lall, P., Lowe, R., Goebel, K., Extended Kalman Filter Models and Resistance Spectroscopy for Prognostication and Health Monitoring of Leadfree Electronics Under Vibration, IEEE Transactions on Reliability, DOI: 10.1109/TR.2012.2220698, Vol. 61, No. 4, pp. 858-871, 2012.
Lall, P., Lowe, R., Goebel, K., Prognostics Health Management of Electronic Systems Under Mechanical Shock and Vibration Using Kalman Filter Models and Metrics, IEEE Transactions On Industrial Electronics, Vol. 59, No. 11, November 2012.
Lall, P., Lowe, R., Goebel, K., Cost Assessment for Implementation of Embedded Prognostic Health Management For Electronic Systems, Proceedings of the ASME 2012 International Mechanical Engineering Congress & Exposition (IMECE2012), Paper Number IMECE2012-93058, pp. 1-11, Houston, Texas, November 9-15, 2012.
Lall, P., Patel, K., Lowe, R., Strickland, M., Geist, D., Montgomery, R., Blanche, J., Area-Array Electronics Models and Survivability Under 50,000g Shock Loads, SMTAI International Conference, pp. 300-311, Orlando, Florida, October 14-18, 2012.
Lall, P., Lowe, R., Goebel, K., “Particle Swarm Optimization with Extended Kalman Filter for Prognostication of Accrued Damage in Electronics Under Temperature and Vibration”, IEEE PHM Conference, Denver, CO, June 18-21, 2012.
Lall, P., Lowe, R., Goebel, K., Health Monitoring of Leadfree Electronics Under Mechanical Shock and Vibration with Particle Filter Based Resistance Spectroscopy, SMTA Journal, Volume 24, Issue 4, pp. 19-32, 2011.