Harsh Environment Electronic Systems

In this research area, electronics technologies for base-plate operating temperatures over the range -40° to 165° C are being developed. The primary goals are to first understand high temperature related failure mechanisms and to then formulate approaches to extend high temperature service life. Substrate reliability and attachment materials are being studied for both metal-backed laminate and metal-backed ceramic substrate technologies. Potential commercial applications include mechatronic electronic modules that are embedded within the automotive engine block or transmission. Deliverables include design guidelines for material selection, processing recommendations, and reliability data.

Area-Leader

Dr. S'ad Hamasha (Research Leader), Dr. Jeffrey C. Suhling (Research Leader)

Objectives

To Study the Reliability of Lead-Free Solder Mixes with Different Doped Solder Pastes in Thermal Cycling Considering the Effect of: 1.) PCB Surface Finish, 2.) Solder Sphere Alloy, 3.) Bi/non-Bi Solder Pastes, and 4.) Isothermal Elevated Temperature Aging
Components including: 1.) Ball Grid Array (BGA), 2.) Quad Flat No-Lead (QFN), 3.) Surface Mount Resistor (SMR)
Develop a Finite Model for the SBGA 304 Component Subjected to Thermal Cycling
Characterize Mechanical and Thermal Properties of Different Layers/Parts of the Package
Use the Measured Properties to Predict Reliability (Thermal Fatigue Life) of the SBGA Component
Investigate the Effects of PCB Laminate (Megtron 6 and FR4) on the Reliability of the SBGA
Correlate the Predicted Life with the Measured Experimental and Failure Analysis Results
Study the Effect of Surface Finish on Various Doped Solder Joints' Reliability Based on Shear and Fatigue Testing
Study and Compare the Cyclic Stress-Strain Behavior (Loop Area, Plastic Strain Range, and Peak Stress) of SAC305 (Sn-3.0Ag-0.5Cu) and SAC_Q (Sn-3.41Ag-0.52Cu-3.3Bi) Lead Free Solders
Study the Degradation of the Stress-Strain Behavior (Elastic Modulus, Yield Stress, and Ultimate Strength) Occurring in Lead Free Solders Due to Mechanical Cycling
Study the Degradation of the Creep Behavior Occurring in Lead Free Solders Due to Mechanical Cycling
Visualize the Microstructural Evolution Occurring in a Fixed Region within a Lead Free Solder Specimen Subjected to Mechanical Cycling (Fatigue Testing)
Understand the Fatigue Failure Mechanisms in SAC305 and SAC_Q (Bi-doped) Lead Free Solder Samples
Investigate the Aging Effects on the Fatigue Failure of these Solder Alloys by Microstructure Based Approach

Project Listings

P15-301 Effects of Aging on the Cyclic Fatigue Life of Pb-Free Alloys
P15-501 Reliability of Aged Lead Free Doped Solders for Temperature Accelerated Life Testing
P17-301 Effect of Surface Finish on the Fatigue Properties of Lead-Free Doped Solder Joints
P17-303 Reliability of Super Ball Grid Array Packages in Accelerated Life Testing
P15-301 Effects of Aging on the Cyclic Fatigue Life of Pb-Free Alloys
P15-501 Reliability of Aged Lead Free Doped Solders for Temperature Accelerated Life Testing
P16-301 Aging Behavior of Solder Joints at Elevated Temperatures
P17-301 Effect of Surface Finish on the Fatigue Properties of Lead-Free Doped Solder Joints
P17-303 Reliability of Super Ball Grid Array Packages in Accelerated Life Testing
P18-104 High Strain-Rate Properties of Electronic Materials at High and Low Operating Temperatures
P18-107 Usage of COTS Copper-Aluminum Wirebond Parts in Harsh Environments
P18-301 Fatigue Properties of SAC-based Solder Joints with Aging
P18-501 Thermal Cycling Reliability of Newly-Developed Solder Materials for Automotive and Harsh Applications
P19-502 Electronic Interconnections under Varying Amplitude Cycling
P18-104a High Strain Rate Properties of SAC305 Solder after Prolonged 100℃ Thermal Aging up to 1-Year
P18-104b Reliability of Leadfree Solders in High Temperature Vibration in Automotive Environments
P18-107a 3-D Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion
P18-107b Stress Strain Analysis on Stitch Bond of Cu-Al Wirebonds Using X-ray Micro CT Technique
P20-102a RUL Estimations of SAC305 Solder PCB’s under Different Conditions of Temperature and Vibration Loads
P20-103a Effect of Shock Angle on Solder-joint Reliability of Potted Assemblies Under High-G Shock
P20-103b Effect of Thermal Aging on the Interface Fracture Toughness of the Substrate-UF Interface
P20-104a High Strain Rate Properties for SAC305 at Cold Operating Temperatures down to -65℃
P20-104b Low Temperature High Strain-Rate Material Properties for SAC-Q Leadfree Alloys
P20-104c Evolution of High Strain Rate Mechanical Properties of SAC-R with High Temperature
Storage at 50℃ with High and Low Operating-Temperatures
P21-501 Drop Shock Performance of Different SAC Solder Alloys Compared to SnPb

Posters

Reliability of Aged Lead-Free Doped Solders for Temperature Accelerated Life Testing - Francy Akkara (ISE)
Reliability Analysis of Super Ball Grid Array Packages - Sudan Ahmed (ME), Munshi Basit (ME)
Effect of Surface Finish on the Shear and Fatigue of Lead-Free Doped Solder Joints - Sinan Su (ISE)
Evolution of the Cyclic Stress-Strain Behavior of Doped SAC Solder Materials Subjected to Isothermal Aging - Md Mahmudur R Chowdhury (ME), Mohd Aminul Hoque (ME)
Evolution of the Cyclic Stress-Strain and Constitutive Behaviors of Doped Lead Free Solder During Fatigue Testing - Mohd Aminul Hoque (ME), Md Mahmudur R Chowdhury (ME)
Effects of Mechanical Cycling on the Microstructure of Lead Free Solders - Md Mahmudur R Chowdhury (ME), Mohd Aminul Hoque (ME)
Effect of Creep and Fatigue on Individual SAC305 Solder Joint Reliability in Iso-thermal Cycling - Mohammed Abueed (ISE), Sa'd Hamasha (ISE)
Electronic Interconnections under Varying Amplitude Cycling -Minghong Jian (ISE), Sa’d Hamasha (ISE)
Effect of Aging on the Fatigue Life of SAC305 Solder Joints in Actual Setting Conditions - Raed Al Athamneh (ISE), Sa’d Hamasha (ISE)
Fatigue Behavior of Actual SAC-based Joints at Elevated Temperatures - Xin Wei (ISE), Sa’d Hamasha (ISE)
Stress Strain Analysis on Stitch Bond of Cu-Al Wirebonds Using X-ray Micro CT Technique - Madhu Kasturi (ME)
Effect of Shock Pulse Variation and Restraint Mechanisms on Surface Mount Electronics under High G Shock - Aathi Pandurangan (ME), Kalyan Dornala (ME)
Effect of Shallow Charging on Flexible Power Source Capacity Subjected to Varying C-Rates and Extreme Temperatures - Amrit Abrol (ME), Ved Soni (ME)
3-D Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion - Yunli Zhang (ME)
Effect of High Temperature Aging at the PCB-Underfill Interfaces under Three-Point Bend Load - Padmanava Choudhury (ME), Pradeep Lall (ME)
Effect of Drop Angle Variation on Surface Mount Electronics under High G Shock - Aathi Pandurangan (ME), Kalyan Dornala (ME), Pradeep Lall (ME)
Effect of Long-Term Isothermal Exposure on Underfill Material Properties - Madhu Kasturi (ME), Haotian Wu (MATL), Pradeep Lall (ME), Ed Davis (ME)
Effect of 100℃ Aging for Periods of up to 120-days on High Strain Rate Properties of SAC305 Alloys - Vishal Mehta (ME), Pradeep Lall (ME)
High Strain Rate Properties for SAC305 at Cold Operating Temperatures down to -65℃ - Vishal Mehta (ME), Pradeep Lall (ME)

Representative Recent Publications

Akkara, F., M. Abueed, A. Srinivasan, M. Belhadi, P. Vyas, S. Hamasha, J. Suhling, P. Lall, Thermal Cycling Reliability of Lead-Free Solder Alloys using Surface Mount Resistors ,Considering Aging, in Proceedings of the 2021 IEEE 20th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 954-959, June 1-4, 2021.

Belhadi, M., F.J. Akkara, M.A. Hoque, P. Vyas, X. Wei, A. Shmatok, S. Hamasha, B.C. Prorok, J. Suhling, P. Lall, Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint, in Proceedings of the 2021 IEEE 20th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 904-910, June 1-4, 2021.

Jian, M., P. Vyas, X. Wei, M. Belhadi, S. Hamasha, J., P. Lall, Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling, in Proceedings of the 2021 IEEE 20th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 991-998, June 1-4, 2021.

Lall, P., Y. Zhang, M. Kasturi, P. Choudhury, H. Wu, J. Suhling, E. Davis, Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year, in Proceedings of the 2021 IEEE 71st Electronic Components and Technology Conference, pp. 971-982, June 1-July 4, 2021.

Wei, X., M. Jian, M. Belhadi, S. Hamasha, J. Suhling, P. Lall, Fatigue Performance of Ball Grid Array Components at Elevated Temperature, in Proceedings of the 2020 IEEE 70th Electronic Components and Technology Conference, pp. 876-884, Orlando, FL, June 3-30, 2020.

Wu, J., M.S. Alam, KM Hassan, J.C. Suhling, P. Lall, Investigation and Comparison of Aging Effects in SAC+X Solders, in Proceedings of the 2020 IEEE 70th Electronic Components and Technology Conference, pp. 492-503, Orlando, FL, June 3-30, 2020.

Alam, M.S., Hassan, KM A. Fahim, J. Wu, S. Ahmed, J.C. Suhling, P. Lall, Investigation of the Mechanical Behavior of SAC305 Solder Joints at Extreme High Temperatures Using Nanoindentation, in Proceedings of the 2020 IEEE 70th Electronic Components and Technology Conference, pp. 2175-2184, Orlando, FL, June 3-30, 2020.

Lall, P., V. Yadav, V. Mehta, J. Suhling, K. Blecker, Extreme Cold-Temperature High-Strain Rate Properties of SAC Solder Alloys, in Proceedings of the 2020 IEEE 70th Electronic Components and Technology Conference, pp. 782-792, Orlando, FL, June 3-30, 2020.

Jian, M., X. Wei, S. Hamasha, J. Suhling, P. Lall, Effect of varying amplitude cycling on SAC-Bi solder joint fatigue, in Proceedings of the 2020 IEEE 19th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1017-1023, July 21-23, 2020.

Wei, X., S. Su, S. Hamasha, H. Ali, J. Suhling, P. Lall, Fatigue Performance of Doped SAC Solder Joints in BGA Assembly, in Proceedings of the 2020 IEEE 19th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1035-1042, July 21-23, 2020.

Belhadi, M., F.J. Akkara, R. Alathamneh, M. Abueed, S. Hamasha, H. Ali, J. Suhling, P. Lall, The effect of Bi on the mechanical properties of aged SAC solder joint, in Proceedings of the 2020 IEEE 19th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1100-1105, July 21-23, 2020.

Akkara, F.J., C. Zhao, A. Sreenivasan, S. Su, M. Abueed, S. Hamasha, H. Ali, J. Suhling, P. Lall, Effect of combining solder pastes with SAC305 spheres on component reliability in harsh thermal cycling, in Proceedings of the 2020 IEEE 19th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1322-1327, July 21-23, 2020.

Hassan, KM, M. Alam, J. Wu, J. Suhling, P. Lall, Microstructural evolution of SAC305 BGA joints during extreme high temperature aging, in Proceedings of the 2020 IEEE 19th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1201-1210, July 21-23, 2020.

Lall, P., V. Mehta, J. Suhling, K. Blecker, High strain rate properties of SAC305 at cold operating temperatures down to -65°C, in Proceedings of the 2020 IEEE 19th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1073-1083, July 21-23, 2020.

Lall, P., M. Saha, J. Suhling, K. Blecker, Evolution of high strain rate mechanical properties of SAC-R with high temperature storage at 50°C with high operating temperatures, in Proceedings of the 2020 IEEE 19th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 993-1000, July 21-23, 2020.

Al Athamneh, R., M. Abueed, D.B. Hani, S. Su, S. Hamasha, J. Suhling, P. Lall, Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions, in Proceedings of the 2019 IEEE 18th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1146-1154, Las Vegas, NV, May 28-May 31, 2019.

Akkara, F.J., C. Zhao, S. Gordon, S. Su, M. Abueed, S. Hamasha, J. Suhling, P. Lall, Effect of Aging on Component Reliability in Harsh Thermal Cycling, in Proceedings of the 2019 IEEE 18th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 717-723, Las Vegas, NV, May 28-May 31, 2019.

Wu, J., J.C. Suhling, P. Lall, Microstructural Evolution in SAC+X Solders Subjected to Aging, in Proceedings of the 2019 IEEE 69th Electronic Components and Technology Conference, pp. 1087-1098, Las Vegas, NV, May 28-May 31, 2019.

Lall, P., K. Dornala, R. Lowe, J. Deep, Explicit FE Failure Prediction of Interfaces and Interconnect in Potted Electronics Assemblies Subject to High-g Acceleration Loads, in Proceedings of the 2019 IEEE 69th Electronic Components and Technology Conference, pp. 1366-1376, Las Vegas, NV, May 28-May 31, 2019.

Su, S., F.J. Akkara, A. Raj, C. Zhao, S. Gordon, S. Sridhar, S. Thirugnanasambandam, S. Hamasha, J. Suhling, P. Lall, Reliability of Micro-Alloyed SnAgCu Based Solder Interconnections for Various Harsh Applications, in Proceedings of the 2019 IEEE 69th Electronic Components and Technology Conference, pp. 2309-2317, Las Vegas, NV, May 28-May 31, 2019.

Lall, P., V. Yadav, J. Suhling, D. Locker, High Strain Mechanical Behavior of SAC-Q Solder, in Proceedings of the 2016 IEEE 66th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1447-1447, Las Vegas, NV, May 31-June 3, 2016.

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