 Pradeep Lall
John and Anne MacFarlane Endowed Distinguished Professor and Director, NSF-CAVE3 Electronics Research Center
Office:1438 Wiggins Hall
Phone: (334) 844-3424
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Ph.D., Mechanical Engineering, University of Maryland, 1993
Finite Element for Continua and Structures; Thermo-mechanics, Reliability and Life-Prediction of Electronics Failure-Mechanisms (including solder joints); Prognostics and Structural Health Monitoring of Electronic Structures; Transient Dynamics of Microcircuits and MEMS in Shock and Vibration; Multi-scale Modeling of NANO-Structures; High Strain-rate Constitutive Behavior of Electronic Materials; Models for Human Body Trauma and Injury.
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 Sa'd Hamasha
Assistant Professor, Industrial and Systems Engineering
Office:3301H Shelby Center
Phone: (334) 844-4340
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Ph.D., Industrial and Systems Engineering, Binghamton University, 2015
Reliability of Electronics Package (Aging, Thermal Cycling, Vibration, Shock, Drop); Isothermal and Thermal Fatigue of Electronic Components and Interconnects; Fatigue and Damage Accumulation in Solder Materials; Microstructure Evolution of Solder Materials in Realistic Applications; Reliability Engineering; Statistical Modeling; Quality Engineering; Lean Six Sigma & Continuous Process Improvement.
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 Jeffrey Suhling
Quina Distinguished Professor and Chair
Office:1418 Wiggins Hall
Phone: (334) 844-3332
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Ph.D., Engineering Mechanics, University of Wisconsin, 1985
Experimental Mechanics, Solid Mechanics, Advanced and Composite Materials, Finite Element Analysis and Computational Mechanics, Continuum Modeling, Electronic Packaging, Silicon Sensors, Solder Joint Reliability, Mechanics of Paper and Other Wood-Based Materials.
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 Daniel Harris
Associate Professor
Office:2418B Wiggins Hall
Phone: (334) 844-3337
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Ph.D., Mechanical Engineering, Purdue University, 1997
Thermal Management of ground based radars, space-based assets, and advanced propulsion systems; Waste Heat Recovery and Use Strategies; Heat pipe technology; Metal felt porous media as conformal wick structures for heat pipes; MEMS cooling technologies and micro-channel heat pipes. |
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 Roy Knight
Associate Professor
Office:3418B Wiggins Hall
Phone: (334) 844-3300
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Ph.D., Mechanical Engineering, The University of Texas, 1986
Thermal sciences as applied to issues in electronics packaging and manufacture; Modelling of one and two phase fluid flows
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 George Flowers
Professor, Dean of Graduate School
Office:3428 Wiggins Hall
Phone: (334) 844-4375
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Ph.D., Mechanical Engineering, Georgia Institute of Technology
Dynamics of Rotating Machinery; Vibration Analysis of Electronic Systems |
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 Michael J. Bozack
Professor Emeritus, Physics
Office:206 Allison Laboratory
Phone: (334) 844-8446
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Ph.D., Applied Physics, Oregon Health and Sciences University, 1985
Gas- and metal-surface reactions, semiconductor surfaces, thin films, ohmic and Schottky contact development, semiconductor processing technology, wide bandgap electronics, liquid metal alloy wetting,and Pb-free solder technology, and tin whiskers.
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 Robert Dean
McWane Endowed Professor, Electrical and Computer Engineering
Office:222 Broun Hall
Phone: (334) 844-1838
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Ph.D., Electrical and Computer Engineering, Auburn University
Sensors; Instrumentation; MEMS; Packaging; Chaos Electronics |
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 Robert Jackson
Albert J. Smith, Jr. Professor
Office:3418E Wiggins Hall
Phone: (334) 844-3340
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Ph.D., Mechanical Engineering, Georgia Institute of Technology, 2004
Multiscale (Macro, Micro and Nano) Tribology, Bearing Testing and Modeling, MEMS, Friction and Wear Fundamentals, Contact Mechanics, Hydrodynamic Lubrication, Bearing Dynamics, Electrical and Thermal Contact Resistance.
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