Current Projects

Microstructural Evolution in Aging Lead Free Solders
High Tensile Temperature and Creep Behavior of Lead Free Solders
Aging Behavior of Solder Joints at Elevated Temperatures
Effect of Shock Angle on Solder-joint Reliability of Potted Assemblies Under High-G Shock
Effect of Thermal Aging on the Interface Fracture Toughness of the Substrate-UF Interface
High Strain Rate Properties for SAC305 at Cold Operating Temperatures down to -65°C
RUL Estimations of SAC305 Solder PCBs under Different Conditions of Temperature and Vibration Loads
Process Consistency in Printed Layers in Multi-Layer Substrate Using Aerosol Jet Technology
Process Development for Printing Z-Axis Interconnects in Multilayered Flexible Substrates
Accelerated Factors for FHE with Human Body Measurements
Effect of Dynamic Folding and Flex-to-Install with Varying Fold Orientations and C-rates on Flexible Power Source Capacity Degradation
Low Temperature and High Strain-Rate Material Properties for SA-Q Leadfree Alloys
Effect of Sustained High-Temperature Operation on Underfill Material Properties
Evolution of High Strain Rate Mechanical Properties of SAC-R with High Temperature Storage at 50°C with High and Low Operating-Temperatures
Degredation Mechanisms of Underfills Subjected to High Temperature Long Term Sustained High Temperature Operation from 150-200°C
Effect of Sintering Process Conditions for Additive Printing of Multi-Layer Circuits using Aerosol-Jet Process with Blind-Vias
Twist Reliability Assessment of Flexible Battery in Wearable Applications
Feature Vectors for Flexible Electronics Under Mechanical Vibration