The Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) at Auburn University is dedicated to working with industry in developing and implementing new technologies for the packaging and manufacturing of electronics with special emphasis on the cost, harsh environment and reliability requirements of the vehicle industry.

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Center personnel work directly with the member companies to identify challenges and opportunities for new materials, processes and approaches to the production of electronics. The member companies select the research projects. Semi-annual project reviews, visits, monthly updates and frequent phone calls maintain a close interaction between the industrial members and Center researchers. CAVE3 currently has 30 members teamed up with Auburn representing material, component, equipment and electronics assembly companies.

Journal Publications
  • Lall, P., Zhang, H., Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter, ASME Journal of Electronic Packaging, Volume 137, No. 2, doi: 10.1115/1.4028957, pp. 1-10, June 2015
  • Lall, P., Wei, J., Prediction of L70 Life and Assessment of Color Shift for Solid State Lighting Using Kalman Filter and Extended Kalman Filter Based Models, IEEE Transactions on Device and Materials Reliability, Volume. 15, No.1, doi 10.1109/TDMR.2014.2369859, pp. 1-15, March 2015.
  • Lall, P., Shantaram, S., Suhling, J., Locker, D., Stress-Strain Behavior of SAC305 at High Strain Rates, ASME Journal of Electronic Packaging, Volume 137, No. 1, doi:10.1115/1.4028641, pp. 1-16, March 2015.
  • Lall, P., Lowe, R., Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Reliability Under Vibration, ASME Journal of Electronic Packaging, Volume 136, No. 4, doi:10.1115/1.4028163, pp. 1-8, December 2014.
  • Lall, P., Shantaram, S., Locker, D., High Strain Rate Properties of SAC105 and SAC305 Leadfree Alloys after Extended High Temperature Storage, Journal of the SMTA, Volume 27, No. 1, pp. 13-27, 2014
Conference Publications
  • Zhang, H., Lall, P., A Comparison of Temperature and Humidity Effects on Phosphor Converted LED Package and the Prediction of Remaining Useful Life with State Estimation, Proceedings from LED A.R.T. Symposium, Atlanta, GA, November 17- 19, 2015
  • Zhang, H., Lall, P., Phosphor Converted LED Failure Mechanisms Related to Phosphor Layer, Proceedings from LED A.R.T. Symposium, Atlanta, GA, November 17- 19, 2015
  • Lall, P., Zhang, D., Suhling, J., Locker, D., Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature, Proceedings of the ASME 2015 International Mechanical Engineering Congress & Exposition (IMECE2015,) Houston, TX, Paper # 53751, pp. 1- 11, November 13-19, 2015
  • Lall, P., Mirza, K., A Study on the Effect of Mean Cyclic Temperature on the Thermal Fatigue Reliability of SAC Solder Joints Using Digital Image Correlation, Proceedings of the ASME 2015 International Mechanical Engineering Congress & Exposition (IMECE2015,) Houston, TX, Paper # 53476, pp. 1- 11, November 13-19, 2015
  • Lall, P., Luo, Y., Nguyen, L., Multiphysics Model for Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages, Proceedings of the ASME 2015 International Mechanical Engineering Congress & Exposition (IMECE2015,) Houston, TX, Paper # 53742, pp. 1- 12, November 13- 19, 2015
  • Lall, P., Kothari, N., Foley, J., Lowe, R., A Novel Micro-CT Data Based Finite Element Modeling Technique to Study Reliability of Densely Packed Fuze Assemblies, Proceedings of 86th Shock and Vibration Symposium (SAVE ’15,) Orlando, FL, October 5- 8, 2015
  • Zhao, C., Shen, C., Hai, Z., Zhang, J., Bozack, M., Evans, J., Long Term Aging Effects on the Reliability of Lead Free Solder Joints In Ball Grid Array Packages With Various Pitch Sizes and Ball Alignments, Proceedings of the SMTAI, Rosemont, IL, pp. 199- 206, September 27- October 1, 2015
  • Raj. A., Thirugnanasambandam, S., Sanders, T., Sridhar, S., Evans, J., Bozack, M., Johnson, W., Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages, Proceeding of the SMTAI, Rosemont, IL, pp. 354- 361, September 27- October 1, 2015
  • Lall, P., Luo, Y., Nguyen, L., Corrosion and Contaminant Diffusion Multi-Physics Model for Copper-Aluminum Wirebonds in High Temperature High Humidity Environments, Proceedings of the SMTAI, Rosemont, IL, pp. 14-27, September 27- October 1, 2015
  • Sanders, T., Thirugnanasambandam, S., Evans, J., Bozack, M., Suhling, J., Johnson, W., Component Level Reliability for High Temperature Power Computing With SAC305 and Alternative High Reliability Solders, Proceeding of the SMTAI, Rosemont, IL, pp. 144- 150, September 27- October 1, 2015
  • Lall, P., Wei, J., Deformation and Strain Measurements in Operational Electronics Using X-Ray Micro-CT and Digital Volume Correlation, Proceeding of the SMTAI, Rosemont, IL, pp. 515- 526, September 27- October 1, 2015
  • Lall, P., Zhang, D., Locker, D., Damage Prediction in SAC305 Lead Free Electronics Subjected to Mechanical Shock After Long-Term Storage, Proceeding of the SMTAI, Rosemont, IL, pp. 904- 914, September 27- October 1, 2015