Harsh Electronics Systems and Manufacturing

In this research area, electronics technologies for base-plate operating temperatures over the range -40 to 165 C are being developed. The primary goals are to first understand high temperature related failure mechanisms and to then formulate approaches to extend high temperature service life. Substrate reliability and attachment materials are being studied for both metal-backed laminate and metal-backed ceramic substrate technologies. Potential commercial applications include mechatronic electronic modules that are embedded within the automotive engine block or transmission. Deliverables include design guidelines for material selection, processing recommendations, and reliability data.

Area-Leader

Dr. John Evans (Research Leader)

Objectives

  • Evaluate the effect of leadfree solder mixes, board plating, and isothermal ageing on the reliability of ball grid arrays (BGA), flip chip components, chip scale packages (CSP), microBGA’s,  and quad flat no lead packages (QFN) for different harsh environments

Project Titles

  • P11-501 Aging effects on reliability of lead-free solder for temperature accelerated life testing
  • P11-502 Reliability of aged lead-free solder for mechanical accelerated life testing
  • P11-503 Reliability for micro BGA packages
  • P11-504 Reliability of wafer level leadfree chip for thermal accelerated life

Posters

  • Aging Effects on Reliability of Leadfree Solder for Temperature Accelerated Life Testing (TV7) - Fei Xie (ISE), John Evans (ISE) , J. Zhang (ISE), 
  • Reliability of aged lead-free solder for mechanical accelerated life testing (TV7) - P. Soobramanry, John Evans (ISE) , J. Zhang (ISE), N. Vijayakumar (ISE)
  • Reliability for micro BGA packages (TV8) - Fei Xie (ISE), John Evans (ISE) , A. Bandaram (ISE), N. Vijayakumar (ISE)
  • Reliability of Wafer Level Lead Free Flip Chip for Thermal Accelerated Life Testing - S. Thirugnanasambandam (ISE), J. Zhang (ISE),  J. Evans (ISE), M. Bozack (Physics)

Publications

Reviews