Harsh Environment Electronic Systems

In this research area, electronics technologies for base-plate operating temperatures over the range -40° to 165° C are being developed. The primary goals are to first understand high temperature related failure mechanisms and to then formulate approaches to extend high temperature service life. Substrate reliability and attachment materials are being studied for both metal-backed laminate and metal-backed ceramic substrate technologies. Potential commercial applications include mechatronic electronic modules that are embedded within the automotive engine block or transmission. Deliverables include design guidelines for material selection, processing recommendations, and reliability data.

Area-Leader

Dr. S'ad Hamasha (Research Leader), Dr. Jeffrey C. Suhling (Research Leader), Dr. Michael Bozack (Research Leader)

Objectives

  • To Study the Reliability of Lead-Free Solder Mixes with Different Doped Solder Pastes in Thermal Cycling Considering the Effect of: 1.) PCB Surface Finish, 2.) Solder Sphere Alloy, 3.) Bi/non-Bi Solder Pastes, and 4.) Isothermal Elevated Temperature Aging (Project: P15-501)
  • Components including: 1.) Ball Grid Array (BGA), 2.) Quad Flat No-Lead (QFN), 3.) Surface Mount Resistor (SMR) (Project: P15-501)
  • Develop a Finite Model for the SBGA 304 Component Subjected to Thermal Cycling (Project: P17-303)
  • Characterize Mechanical and Thermal Properties of Different Layers/Parts of the Package (Project: P17-303)
  • Use the Measured Properties to Predict Reliability (Thermal Fatigue Life) of the SBGA Component (Project: P17-303)
  • Investigate the Effects of PCB Laminate (Megtron 6 and FR4) on the Reliability of the SBGA (Project: P17-303)
  • Correlate the Predicted Life with the Measured Experimental and Failure Analysis Results (Project: P17-303)
  • Study the Effect of Surface Finish on Various Doped Solder Joints' Reliability Based on Shear and Fatigue Testing (Project: P17-301)
  • Study and Compare the Cyclic Stress-Strain Behavior (Loop Area, Plastic Strain Range, and Peak Stress) of SAC305 (Sn-3.0Ag-0.5Cu) and SAC_Q (Sn-3.41Ag-0.52Cu-3.3Bi) Lead Free Solders (Project: P15-301)
  • Study the Degredation of the Stress-Strain Behavior (Elastic Modulus, Yield Stress, and Ultimate Strength) Occurring in Lead Free Solders Due to Mechanical Cycling (Project: P15-301)
  • Study the Degredation of the Creep Behavior Occurring in Lead Free Solders Due to Mechanical Cycling (Project: P15-301)
  • Visualize the Microstructural Evolution Occurring in a Fixed Region within a Lead Free Solder Specimen Subjected to Mechanical Cycling (Fatigue Testing) (Project: P15-301)
  • Understand the Fatigue Failure Mechanisms in SAC305 and SAC_Q (Bi-doped) Lead Free Solder Samples (Project: P15-301)
  • Investigate the Aging Effects on the Fatigue Failure of these Solder Alloys by Microstructure Based Approach (Project: P15-301)

Project Titles

  • P15-501 Reliability of Aged Lead Free Doped Solders for Temperature Accelerated Life Testing
  • P17-303 Reliability of Super Ball Grid Array Packages in Accelerated Life Testing 
  • P17-301 Effect of Surface Finish on the Fatigue Properties of Lead-Free Doped Solder Joints 
  • P15-301 Effects of Aging on the Cyclic Fatigue Life of Pb-Free Alloys

Posters

  • Reliability of Aged Lead-Free Doped Solders for Temperature Accelerated Life Testing - Francy Akkara (ISE)
  • Reliability Analysis of Super Ball Grid Array Packages - Sudan Ahmed (ME), Munshi Basit (ME)
  • Effect of Surface Finish on the Shear and Fatigue of Lead-Free Doped Solder Joints - Sinan Su (ISE)
  • Evolution of the Cyclic Stress-Strain Behavior of Doped SAC Solder Materials Subjected to Isothermal Aging - Md Mahmudur R Chowdhury (ME), Mohd Aminul Hoque (ME)
  • Evolution of the Cyclic Stress-Strain and Constitutive Behaviors of Doped Lead Free Solder During Fatigue Testing - Mohd Aminul Hoque (ME), Md Mahmudur R Chowdhury (ME)
  • Effects of Mechanical Cycling on the Microstructure of Lead Free Solders - Md Mahmudur R Chowdhury (ME), Mohd Aminul Hoque (ME)


Representative Recent Publications
Lall, P., Yadav, V., Suhling, J., Locker, D., High Strain Mechanical Behavior of SAC-Q Solder, Proceedings of the IEEE 2016 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm2016), Las Vegas, NV, pp. 1447-1447, May 31-June 3, 2016.



Publications

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