Prognostic Health Management for Electronics

Prognostics Health Management (PHM) is the interrogation of system state and the assessment of product survivability in deployed systems using non-destructive assessment of underlying damage. System health is generally assessed in the actual operating environment. The prior stress history to which the system may have been subjected may not be known in several cases. Prognostics health management is very different from reliability prediction which often assumes pristine materials and uses models which require definitive specification of environmental loads.

Figure 1: Approach for PHM for Thermo-mechanics, Shock and Vibration Environments

Figure 1: Approach for PHM for Thermo-mechanics, Shock and Vibration Environments

In recent past, PHM has emerged as a key enabling technology to provide an early warning of failure. Early warning may be used to forecast planned-maintenance and assess the potential for life extensions. PHM has been applied to machines, aircraft, bridges, electronics, and bio-implantable systems. Avionic systems require ultra-high reliability operation with minimal downtime. Automotive safety features such as anti-lock braking, airbags, and collision avoidance systems depend on electronics for their performance and reliability. Implantable biological systems are often life-sustaining in nature. Deployed electronic systems often may be subjected to multiple thermal environments. Thermal environments may change due to operational environments or change in usage profiles. Decision-support for re-deployment requires PHM based methods for assessment of the operational readiness of electronic systems based on accrued damage and residual life in intended environment. PHM will enable self-cognizant systems capable of assessing their own real-time performance under actual usage conditions and adaptively trigger risk-mitigation actions to virtually eliminate unplanned failures.

Representative Recent Publications

Prognostics Using Kalman-Filter Models and Metrics for Risk Assessment in BGAs Under Shock and Vibration Loads Pradeep Lall, Ryan Lowe, and Kai Goebel, Electronic Components and Technology Conference, 2010. ECTC 2010. 60th, 889-901, 2010.

Assessment of Residual Damage in Lead-free Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling Pradeep Lall, Rahul Vaidya, Vikrant More, Kai Goebel, Jeff Suhling, Electronic Components and Technology Conference, 2010. ECTC 2010. 60th, pp. 206-218, 2010.

Self-Organized Mapping of Failure Modes in Portable Electronics Subjected to Drop and Shock Pradeep Lall, Prashant Gupta, Dhananjay Panchagade, Electronic Components and Technology Conference, 2010. ECTC 2010. 60th, 1195-1208, 2010.

Use of Prognostics in Risk-Based Decision Making For BGAs Under Shock And Vibration Loads Pradeep Lall, Ryan Lowe, and Kai Goebel, Proceedings of ITHERM 2010, Las Vegas, NV, June 2-5, 2010.

PHM-Based Residual Life Computation of Electronics Subjected to a Combination of Multiple Cyclic-Thermal Environments Pradeep Lall, Rahul Vaidya, Vikrant More, Kai Goebel, Jeff Suhling, Proceedings of ITHERM 2010, Las Vegas, NV, June 2-5, 2010.

Fault-Isolation in Portable Electronics Subjected to Drop And Shock Pradeep Lall, Prashant Gupta, Dhananjay Panchagade, Arjun Angral, Proceedings of ITHERM 2010, Las Vegas, NV, June 2-5, 2010.

Prognostication For Impending Failure In Leadfree Electronics Subjected to Shock and Vibration Using Resistance Spectroscopy Pradeep Lall, Ryan Lowe, Jeff Suhling. 42nd Symposium on Microelectronics (IMAPS), San Jose, CA, Nov 1-5, 2009.

Prognostics and Condition Monitoring of Electronics Pradeep Lall, Prashant Gupta, Dhananjay Panchagade, Manish Kulkarni, Jeff Suhling, James Hofmeister. Proceedings of the 10th International Conference on Thermal, Mechanical, and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSIME), Netherlands, Technical University of Delft, April 2009.

Feature Extraction and Health Monitoring using Image Correlation for Survivability of Leadfree Packaging under Shock and Vibration Pradeep Lall, Deepti Iyengar, Sandeep Shantaram, Prashant Gupta, Dhananjay Panchagade, Jeff Suhling, Proceedings of the 9th International Conference on Thermal, Mechanical, and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSIME), Freiburg, Germany, pp. 594-608, April 16-18, 2008.

Resistance spectroscopy-based condition monitoring for prognostication of high reliability electronics under shock-impact Pradeep Lall, Ryan Lowe, and Kai Goebel, Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 1245-1255, 2009.

Leading-Indicators Based on Impedance Spectroscopy for Prognostication of Electronics under Shock and Vibration Loads Pradeep Lall, Ryan Lowe, and Kai Goebel, and Jeff Suhling. International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS. San Francisco, CA, 2009.

Fault-mode classification for health monitoring of electronics subjected to drop and shock Pradeep Lall, Prashant Gupta, Dhananjay Panchagade, and Arjun Angral. Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 668-681, 2009.

Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads Pradeep Lall, Madhura Hande, Chandan Bhat, Vikrant More, and Rahul Vaidya. Microelectronics Reliability 49, no. 8 (2009): 825-838

Explicit Submodeling and Digital Image Correlation Based Life-Prediction of Leadfree Electronics under Shock-Impact Pradeep Lall, Sandeep Shantaram, Arjun Angral, Mandar Kulkarni. Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 668-681, 2009.

Prognostication of latent damage and residual life in leadfree electronics subjected to multiple thermal-environments Pradeep Lall, Vikrant More, Rahul Vaidya, and Kai Goebel. In Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 1381-1392, 2009.

Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration Pradeep Lall, Prashant Gupta, Arjun Angral, Jeff Suhling, International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS. San Francisco, CA, 2009.

Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal Environments Pradeep Lall, Rahul Vaidya, Vikrant, More, Jeff Suhling, International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS. San Francisco, CA, 2009.

Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact Pradeep Lall, Sandeep Shantaram, Arjun Angral, Mandar Kulkarni, Jeff Suhling, International Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS. San Francisco, CA, 2009.

Interrogation of System State for Damage Assessment in Lead-free Electronics Lall, P., Bhat, C., Hande, M., More, V., Vaidya, R., Pandher, R., Suhling, J., Goebel, K., Proceedings of 58th Electronic Components & Technology Conference 2008, pp. 918-929, Orlando, FL, May 27-30, 2008.

Algorithms For Prognostication Of Prior Damage And Residual Life In Lead-Free Electronics Subjected To Thermo-Mechanical Loads Lall, P., Hande, M., Bhat, C., More, V., Vaidya, R., Suhling, J., Proceedings of ITHERM 2008, pp. 638-651, Orlando, FL, May 28-31, 2008.

Health Monitoring Of Implantable Biological Electronic Systems By Statistical Pattern Recognition Techniques Lall, P., Gupta, P., Choudhary, P., Kulkarni, M., Suhling, J., Proceedings of ITHERM 2008, pp. 726-737, Orlando, FL, May 28-31, 2008.

Prognostication And Health Monitoring Of Electronics In Implantable Biological Systems Lall, P., Gupta, P., Kulkarni, M., Panchagade, D., Suhling, J., 2008 ASME International Mechanical Engineering Congress and Exposition, pp. 1-15, Boston, MA, Oct 31- Nov 6, 2008.

Interrogation Of System State Of Aerospace Electronic Systems Subjected To Thermo-Mechanical Loads Lall, P., Bhat, C., Hande, M., More, V., Vaidya, R., Suhling, J., Proceedings of the 2008 SMTA International, pp. 857-869, Orlando, FL, Aug 17-21, 2008.

Latent Damage Assessment and Prognostication of Residual Life in Airborne Lead-free Electronics Under Thermo-Mechanical Loads Lall, P., Bhat, C., Hande, M., More, V., Vaidya, R., Pandher, R., Suhling, J., Goebel, K., International Conference on Prognostics and Health Management, pp. 1-12, Denver, CO, Oct 6-9, 2008.

Prognostics Health Monitoring (PHM) for Prior-Damage Assessment in Electronics Equipment under Thermo-Mechanical Loads Lall, M., Hande, M., Bhat, C., Suhling, J., Lee, J., Proceedings of 57th Electronic Components & Technology Conference 2007, pp. 1097-1111, Reno, NV, May 29 - Jun 1, 2007.

Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads Lall, P., Choudhary, P., Gupte, S., Suhling, J., Hofmeister, J., Proceedings of 57th Electronic Components & Technology Conference 2007, pp. 1161-1178, Reno, NV, May 29 - Jun 1, 2007.

Time-Frequency Analysis And Built-In Reliability Test For Health Monitoring Of Electronics Under Shock Loads Lall, P., Choudhary, P., Gupte, S., Gupta, P., Suhling, J., Hofmeister, J., 2007 ASME International Mechanical Engineering Congress and Exposition, pp. 1-19, Seattle, WA, Nov 11-15, 2007.

Methodologies For System-State Interrogation For Prognostication Of Electronics Under Thermo-Mechanical Loads Lall, P., Hande, M., Bhat, C., Suhling, J., 2007 ASME International Mechanical Engineering Congress and Exposition, pp. 1-16, Seattle, WA, Nov 11-15, 2007.

Leading Prognostic Indicators For Health Managementof Electronics Under Thermo-Mechanical Stresses Lall, P., Hande, M., Bhat, C., Suhling, J., 2007 ASME InterPACK, pp. 1-16, Vancouver, British Columbia, CANADA, July 8-12, 2007.

Health Monitoring for Damage Initiation & Progression during Mechanical Shock in Electronic Assemblies Lall, P., Choudhary, P., Gupte, S., Suhling, J., Proceedings of 56th Electronic Components & Technology Conference 2006, pp. 85-94, San Diego, CA, May 30 - Jun 2, 2006.

Feature Extraction and Damage-Precursors for Prognostication of Lead-Free Electronics Lall, P., Hande. M., Bhat, C., Islam, N., Suhling, J., Lee, J., Proceedings of 56th Electronic Components & Technology Conference 2006, pp. 718-727, San Diego, CA, May 30 - Jun 2, 2006.

Sensor Data-Fusion for Prognostication of Extreme Environment Electronics Lall, P., Hande, M., Bhat, C., Islam, N., Rahim, S., Suhling, J., Lee, J., Proceedings of the 2006 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, pp. 1-15, St. Louis, MO, Jun 4-7, 2006.

Prognostication and Health Monitoring of Leaded and Lead Free Electronic and MEMS Packages in Harsh Environments Lall, P., Islam, N., Suhling, J., Proceedings of 55th Electronic Components & Technology Conference 2005, pp. 1305-1313, Lake Buena Vista, FL, May 31- Jun 3, 2005.

Methodologies For Prognostication And Health Monitoring Of Leaded And Lead Free Electronics And Mems Packages In Harsh Environments Lall, P., Islam, N., Choudhary, P., Suhling, J., 2005 ASME International Mechanical Engineering Congress and Exposition, pp. 1-9, Orlando, FL, Nov 5-11, 2005.

Leading Indicators Of Failure For Prognostication Of Leaded And Lead-Free Electronics In Harsh Environments Lall, P., Islam, N., Choudhary, P., Suhling, J., Proceedings of InterPACK 2005, pp. 1-9, San Francisco, CA, Jul 17-22, 2005.

Methodology For Prognostication Of Electronics And Mems Packaging Lall, P., Islam, N., Rahim, K., Suhling, J., Proceedings of the 2004 SMTA International, pp. 17-26, Chicago, IL, Sept 26-30, 2004.