AIMS/Harsh Environments (at the SMTAI 2012, Orlando, FL)
Organized by John Evans and Pradeep Lall, CAVE3, Auburn University
Monday, October 15
8:30am – 5:00pm | Australia 3
This symposium will address the concerns related to harsh environment electronics and the challenges within the electronics community, with an added emphasis on military and space. It is intended to bring together the needs of "end-users" with the capabilities of the research community and the industrial supply base. Specifically, the Symposium addresses the challenges of meeting expanding temperature ranges (-55C to +150C/+200C) with increased vibration, higher package density and longer reliability. Next generation requirements are explored from the system level and potential supply-based solutions are presented.
HE1: Pb-Free Solders for Sustained Elevated Temperature Service
Chair: John Evans, Ph.D., Auburn University
Co-Chair: Mike Bixenman, DBA, Kyzen Corporation
Monday, October 15 | 8:30am – 10:30am | Australia 3
The implementation of Pb-free solder solutions has become a mainstream activity within the consumer electronics market. However, it has just recently begun to branch out into the high-reliability electronics sector. A particular challenge for these products is the need for them to operate in harsh environment – temperature extremes, shock, vibration, etc. There has been a great deal of progress made to fit Pb-free interconnections into these applications as is reflected by the four presentations in this session. The first paper examines a relatively new solder paste system having a BiAgX metal component that is targeted to replace the high-Pb solders used in die attach functions. Metal materials are preferred for thermal management as well as for posing a minimal outgassing concern. The second presentation will address the the long-term performance of Pb-free solder joints used on passive components and active devices. The final two papers of the session investigate the role that long-term exposure to elevated temperatures has on the mechanical performance of Pb-free interconnections. Creep behavor, as the underlying property that controls deformation under these temperature conditions, will be observed to uniquely alter the overall behavior of the solder joint, depending on the latter’s materials set and geometry. This session is invaluable to the engineer tasked with looking at Pb-free solder solutions that will fit into applications having extreme environments.
- BiAgX Solder Paste System - A Drop-in Solution for High Temperature Lead-Free Die Attach Application
*Ning-Cheng Lee, Ph.D., HongWen Zhang, Ph.D., Indium Corporation
- Reliability of Passive and Active Components with Differences According to Lead-Free Paste Characterization
Jörg Trodler, Heraeus Materials Technology GmbH & Co. KG
- Isothermal Aging Effects on the Harsh Environment Performance of Lead-Free Solder Joints
Jiawei Zhang, Ph.D., Zhou Hai, Sivasubramanian Thirugnanasambandam, John L. Evans, Ph.D., M. J. Bozack, Richard Sesek, Center for Advanced Vehicle and Electronics - Auburn University
- Aging Effects on Creep Behavior of Lead-Free Solder Joints and Reliability of Fine-Pitch Packages
Jiawie Zhang, Ph.D., Zhou Hai, Sivasubramanian Thirugnanasambandam, John Evans, Ph.D., Michael J. Bozack, Yifei Zhang, Jeffrey C. Suhling, Richard Sesek, Center for Advanced Vehicle and Extreme Environment Electronics - Auburn University
HE2: Experimental Determination and Modeling of Materials for High Reliability Devices
Chair: Brian Toleno, Ph.D., Henkel Corporation
Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
Monday, October 15 | 11:00am – 12:30pm | Australia 3
Surface mount technology devices are used in a many different applications with a variety of reliability requirements. In order to determine the reliability of such complex devices there needs to be an understanding of each of the major structures that go into these devices. In this session the performance and reliability of PCB laminates, soldermasks, silicone encapsulant materials, and components will be discussed.
- Electrical Performance Evaluation of High-Frequency Laminates as a Function of Temperature
Brian Wright, Agilent Technologies
- Reliability Assessment of SMT Assembly with Prediction of its Board-Level Interconnect Life Distribution
Jingsong Xie, Ph.D., RelEng Technologies, Inc.
- Designing a Silicone System to Reduce Permeability to Moisture
Julie Harber and Michelle Velderrain, NuSil Technology, LLC
HE3: Testing and Failure Mechanisms in Harsh Operational Environments
Chair: Tom Borkes, The Jefferson Project
Co-Chair: Mitchell Ferrill, IBM Corporation
Monday, October 15 | 1:30pm – 3:00pm | Australia 3
Designing and assembling an electronic product that "works" is a necessary, but certainly not a sufficient condition for product success. The product must perform to specification over its designated lifetime. This becomes more challenging if the product lifetime contains harsh environmental loading and exposure. Presented in this session are three leading edge papers that address a range of harsh conditions and corresponding design, assembly and test methodologies for printed circuit board assemblies – from a design and process parametric study of creep corrosion, to surviving 50,000g shock loading using compliant interconnects. Finally, a paper is presented that provides a more accurate predictive model through an Innovative accelerated life testing strategy.
- iNEMI Creep Corrosion Project: Investigation of Factors That Influence Creep Corrosion on Printed Circuit Boards - Part 2
Anil Kurella, Ph.D., Intel Corporation; PJ Singh, IBM Corporation; Jennifer Burlingame, Cisco Systems; Haley Fu, iNEMI; Cherie Chen, IST; Simon Lee, Dow Chemical
- Area-Array Electronics Models and Survivability Under 50,000G Shock Loads
*Pradeep Lall, Ph.D., Kewal Patel, Ryan Lowe, Auburn University; Mark Strickland, Dave Geist, Randall Montgomery, and Jim Blanche, NASA
- Alternative Testing Methods for Electronic Assemblies
Mathias Nowottnick, Andrej Novikov, University of Rostock; Dirk Schade, Bob Sykes, XYZTEC BV
HE4: Screening and Prolonged Operation for Harsh Environments
Chair: Pradeep Lall, Ph.D., Auburn University
Co-Chair: Mumtaz Bora, Peregrine Semiconductor
Monday, October 15 | 3:30pm – 5:00pm | Australia 3
Electronic systems operating in harsh environments may often undergo prolonged exposure to high temperature and humidity for extensive periods of their operational life. Screening for latent defects and active failure mechanisms encountered in such mission critical systems may often be very different from those in typical consumer electronics. This session focuses on the general theme of screening, and failure mechanisms under prolonged operation. The first paper presents method for reduction in burn-in energy costs based on insights from weibull distributions. The second paper presents a novel interconnect for prolonged operation at high temperature. The third paper presents the failure mechanism of whiskers which may be a dominant failure mechanism in long-life systems.
- If You Can't Take The Heat (There Are Other Options...)
Robert M. S. Simon, USTEK Inc.
- New Interconnection for High Temperature Application: HotPowCon (HPC)
Jörg Trodler, Heraeus Materials Technology GmbH & Co. KG; A. Fix., T. Herberholz, Ph.D., Robert Bosch, M. Nowottnick, Ph.D., University of Rostock
- Mechanical and Electrical Properties of Sn, Zn and Cd Whiskers
Aleksandra Fortier, Ph.D., Vikranth Gullapplli, University of North Texas