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| Research Area: Lead Free Soldering | | In this research area, potential lead-free solder alloys and corresponding lead-free surface finishes (board and component) are being identified to replace eutectic 63Sn-37Pb solder in harsh environment applications. The primary goal is to develop a fundamental understanding of alternate solder alloys that will meet the high reliability, and high volume low cost manufacturing needs of the vehicle industry. Deliverables include recommended solder alloys; solderability (wetting) measurements; thermal cycling reliability data, stress-strain and creep results as a function of temperature, constitutive and solder fatigue models; and processing recommendations. | | Personnel | Research Area Information |
Michael J. Bozack (Research Leader)
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