|
|
| Research Area: Harsh Electronics Systems and Manufacturing | | In this research area, electronics technologies for base-plate operating temperatures over the range -40 to 165 C are being developed. The primary goals are to first understand high temperature related failure mechanisms and to then formulate approaches to extend high temperature service life. Substrate reliability and attachment materials are being studied for both metal-backed laminate and metal-backed ceramic substrate technologies. Potential commercial applications include mechatronic electronic modules that are embedded within the automotive engine block or transmission. Deliverables include design guidelines for material selection, processing recommendations, and reliability data. | | Personnel | Research Area Information |
John L. Evans (Research Leader)
| |
|