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| Research Area: Flip Chip and Underfills | | In this research area, materials and processes are being explored for flip chip assemblies deployed in extreme thermal cycling environments. The primary objective is to develop a fundamental understanding of the reliability of flip chip applications in automotive and other harsh environment applications. Project deliverables include design and material guidelines for flip chip packages used in the automotive thermal cycling environment; material properties and adhesion characteristics of underfill encapsulants; flip chip thermal cycling reliability data; assembly and processing recommendations; and finite element and material models for application to future package designs. | | Personnel | Research Area Information |
Jeffrey C. Suhling (Research Leader)
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