| In this research area, reliable component packaging technologies (BGA, CSP, 3D Packaging, QFN, etc.) are being developed for harsh environments such as automotive under-the-hood and aerospace applications. The major goal is to develop fundamental knowledge on the interactions between component design and material selection on package reliability and thermal performance in harsh thermal cycling and vibration environments. Deliverables include crack propagation and damage models; thermal cycling reliability data; algorithms for prognostication; computational models for reliability and thermal performance; design guidelines and decision support tools; and models for shock, drop, and vibration. |