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Selected Recent Publications

  1. Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics, Lall, P., Shirgaokar, A., Suhling, J., IMECE2008-68274, pp. 1-17, ASME International Mechanical Engineering Congress and Exhibition, Boston, MA, Oct 31-Nov 6, 2008

  2. Prognostication and Health Monitoring of Electronics in Implantable Biological Systems, Lall, P., Gupta, P., Kulkarni, M., Panchagade, D., Suhling, J., Hofmeister, J., IMECE2008-68275, pp. 1-15, ASME International Mechanical Engineering Congress and Exhibition, Boston, MA, Oct 31-Nov 6, 2008

  3. Survivability Assessment of SAC Leadfree Packaging Under Shock and Vibration using Optical High-Speed Imaging, Lall, P., Iyengar, D., Shantaram, S., Panchagade, D., Suhling, J., Proceedings of the SMTAI, Orlando, Florida, pp. 519-531, Aug 17-21, 2008.

  4. Interrogation of System State of Aerospace Electronic Systems Subjected to Thermo-Mechanical Loads, Lall, P., Bhat, C., Hande, M., More, V., Vaidya, R, Pandher, R., Suhling, J., Goebel, K., Proceedings of the SMTAI, Orlando, Florida, pp. 857-869, Aug 17-21, 2008.

  5. Properties of Mixed Formulation Solders, Zhang, Y., Mitchell, C., Suhling, J. C., Evans, J., Lall, P., Bozack, M., Proceedings of the SMTAI, Orlando, Florida, pp. 644-651, Aug 17-21, 2008.

  6. Characterization of Stress In High Performance Server Microprocessors, Roberts, J., Rahim, K., Suhling, J., Jaeger, R., Lall, P., Proceedings of the 2008 SEM XI International Congress and Exposition on Experimental and Applied Mechanics, Orlando, Florida, Paper 399, pp. 1-12, June 2-5, 2008

  7. Damage Progression using Speckle-Correlation and High-Speed Imaging for Survivability of Leadfree Packaging under Shock, Lall, P., Iyengar, D., Shantaram, S., Panchagade, D., Suhling, J., Proceedings of the 2008 SEM XI International Congress and Exposition on Experimental and Applied Mechanics, Orlando, Florida, Paper 399, pp. 1-16, June 2-5, 2008

  8. Algorithms for Prognostication of Prior Damage and Residual Life in Lead-Free Electronics Subjected to Thermo-Mechanical Loads, Lall, P., Hande, M., Bhat, C., More, V., Vaidya, R., Suhling, J., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 638-651, May 28-31, 2008

  9. Physical Aging and Evolving Mechanical Behavior of Underfill Encapsulants, Lin, C., Suhling, J., Lall, P., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 695-704, May 28-31, 2008

  10. Die Stress Variation in Area Array Components Subjected to Accelerated Life Testing, Roberts, J., Rahim, K., Hussain, S., Suhling, J., Jaeger, R., Lall, P., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 705-713, May 28-31, 2008

  11. Health Monitoring of Implantable Biological Electronic Systems by Statistical Pattern Recognition Techniques, Lall, P., Gupta, P., Choudhary, P., Kulkarni, M., Suhling, J., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 726-737, May 28-31, 2008

  12. Principal Component Regression Models for Life Prediction of Plastic Ball Grid Arrays On Copper-Core and No-Core Assemblies, Lall, P., Shirgaokar, A., Drake, L., Moore, T., Suhling, J., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 770-785, May 28-31, 2008

  13. Development of Survivability Envelopes for SnAg Leadfree Packaging Architecures under Shock and Vibration, Lall, P., Iyengar, D., Shantaram, S., Panchagade, D., Suhling, J., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 822-835, May 28-31, 2008

  14. Finite Element Models for Simulation of Wear in Electrical Contacts, Lall, P., Shinde, D., Rickett, B., Suhling, J., Proceedings of the 10th Intersociety Thermal and Thermo-mechanical Phenomena (ITherm), Orlando, Florida, pp. 836-841, May 28-31, 2008

  15. The Effects of Aging Temperature on SAC Solder Joint Material Behavior and Reliability, Zhang, Y., Cai, Z., Suhling, J., Lall, P., Bozack, M. J., Proceedings of the 58th Electronic Components and Technology Conference (ECTC), Orlando, Florida, pp. 99-112, May 27-30, 2008

  16. Interrogation of System State for Damage Assessment in Lead-free Electronics Subjected to Thermo-Mechanical Loads, Lall, P., Bhat, C., Hande, M., More, V., Vaidya, R, Pandher, R., Suhling, J., Goebel, K., Proceedings of the 58th Electronic Components and Technology Conference (ECTC), Orlando, Florida, pp. 918-929, May 27-30, 2008

  17. Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Leadfree Packaging Architectures under Shock and Vibration, Lall, P., Iyengar, D., Shantaram, S., Pandher, R., Panchagade, D., Suhling, J., Proceedings of the 58th Electronic Components and Technology Conference (ECTC), Orlando, Florida, pp. 1036-1047, May 27-30, 2008

  18. Time-Frequency and Auto-Regressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems, Lall, P., Gupta, P., Kulkarni, M., Panchagade, D., Suhling, J., Hofmeister , J., Proceedings of the 58th Electronic Components and Technology Conference (ECTC), Orlando, Florida, pp. 1196-1207, May 27-30, 2008

  19. Stress Measurements in Large Area Array Flip Chip Microprocessor Chips, Roberts, J., Rahim, K., Suhling, J., Jaeger, R., Lall, P., Proceedings of the 58th Electronic Components and Technology Conference (ECTC), Orlando, Florida, pp. 1462-1471, May 27-30, 2008

  20. Health Monitoring for Damage Initiation & Progression during Mechanical Shock in Electronic Assemblies, Lall, P., Choudhary, P., Gupte, S., Suhling, J., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 173-183, March 2008.

  21. Nano-Underfills for High-Reliability Applications in Extreme Environments, Lall, P., Islam, S., Suhling, J., Tian, G., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 114-125, March 2008.

  22. Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging, Lall, P., Panchagade, D., Choudhary, P., Gupte, S., Suhling, J., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 104-113, March 2008.

  23. System Design Issues for Harsh Environment Electronics Employing Metal-backed Laminate Substrates, Evans, J., Lall, P., Crain, E., Shete, T., Thompson, J. R., Naylis, D., IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 1, pp. 74-85, March 2008.

  24. Thermo-mechanical Reliability Management Models for Area-Array Packages on Cu-Core and No-Core Assemblies, Lall, P., Shah, M., Drake, L., Moore, T., Suhling, J., SMTA Journal, Vol. 21, No. 3, pp. 20-35, 2008.

  25. KEYNOTE PRESENTATION: Feature Extraction and Health Monitoring using Image Correlation for Survivability of Leadfree Packaging under Shock and Vibration, Lall, P., Iyengar, D., Shantaram, S., S., Gupta, P., Panchagade, D., Suhling, J., Proceedings of the 9th International Conference on Thermal, Mechanical, and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSIME), Freiburg, Germany, pp. 594-608, April 16-18, 2008.

  26. Aging Induced Evolution of Free Solder Material Behavior, Ma, H., Zhang, Y., Cai, Z., Suhling, J., Lall, P., Bozack, M., Proceedings of the 9th International Conference on Thermal, Mechanical, and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSIME), Freiburg, Germany, pp. 335-346, April 16-18, 2008.

  27. Prognostication of System-State in Leadfree Electronics Equipment under Cyclic and Steady-State Thermo-mechanical Loads, Lall, P., Hande, M., Bhat, C., More, V., Vaidya, R., Suhling, J., Proceedings of the 9th International Conference on Thermal, Mechanical, and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSIME), Freiburg, Germany, pp. 347-360, April 16-18, 2008.

  28. Time-Frequency Analysis and Built-in Reliability Test for Health Monitoring of Electronics Under Shock Loads, Lall, P., Choudhary, P., Gupte, S., Gupta, P., Suhling, J., Hofmeister, J., Paper IMECE2007-42546, Proceedings of the International Mechanical Engineering Congress and Exposition, Seattle, WA, Nov 11-15, 2007.

  29. Methodologies for System-State Interrogation for Prognostication of Electronics Under Thermo-Mechanical Loads, Lall, P., Hande, M., Bhat, C., Suhling, J., Paper IMECE2007-42560, Proceedings of the International Mechanical Engineering Congress and Exposition, Seattle, WA, Nov 11-15, 2007.

  30. Thermo-Mechanical Reliability Based Part Selection Models for Addressing Part Obsolescence in CBGA, CCGA, FLEXBGA, and Flip-Chip Packages, Lall, P., G. Hariharan, A. Shirgaokar, J. Suhling, M. Strickland, J. Blanche, Proceedings of the ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33832, pp. 1-18, July 8-12, 2007. 

  31. Transient-Response Spectral Analysis Based Feature Extraction For Built-In Reliability Test of Electronics Under Shock Loads, Lall, P., P. Choudhary, S. Gupte, P. Gupta, J. Suhling, ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33872, pp. 1-19, July 8-12, 2007. 

  32. Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses, Lall, P., M. Hande, C. Bhat, J. Suhling, ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33876, pp. 1-19, July 8-12, 2007. 

  33. Die Stress Variation During Thermal Cycling Reliability Tests, Rahim, M. K., J. Roberts, J. C. Suhling, R. C. Jaeger, P. Lall, Proceedings of the ASME InterPACK Conference, Vancouver, British Columbia, Canada, IPACK2007-33548, pp. 1-12, July 8-12, 2007. 

  34. Cohesive-Zone Explicit Sub-Modeling for Shock Life-Prediction in Electronics, Lall, P., S. Gupte, P., Choudhary, J. , Suhling, R., Darveaux, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 515-527, May 29-June 1, 2007. 

  35. High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics, Lall, P., D. Panchagade, D. Iyengar, S. Shantaram, J. Suhling, H. Schrier, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 924-939, May 29-June 1, 2007. 

  36. Prognostics Health Monitoring (PHM) for Prior-Damage Assessment in Electronics Equipment under Thermo-Mechanical Loads, Lall, P., M. Hande, C. Bhat, J. Suhling, Jay Lee, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 1097-1111, May 29-June 1, 2007. 

  37. Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads, Lall, P., P. Choudhary, S. Gupte, J. Suhling, J. Hofmeister, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 1161-1178, May 29-June 1, 2007. 

  38. The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints, Ma, H., J. Suhling, Y. Zhang, P. Lall, M. Bozack, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 653-668, May 29-June 1, 2007. 

  39. Continuous In-Situ Die Stress Measurements During Thermal Cycling Accelerated Life Testing, Rahim, M. K., J. Roberts, J. C. Suhling, R. C. Jaeger, P. Lall, Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, pp. 1478-1489, May 29-June 1, 2007. 

  40. Solder-Joint Reliability in Electronics Under Shock and Vibration using Explicit Finite Element Sub-modeling, Lall, P., Gupte, S., Choudhary, P., Suhling, J., IEEE Transactions on Electronic Packaging Manufacturing, Vol. 30, No. 1, pp.74-83, January 2007. 

  41. Feature Extraction and Damage Data for Prognostication of Leaded and Leadfree Electronics, Lall, P., Hande, M., Singh, N., Suhling, J., Lee, J., Proceedings of the 56th IEEE Electronic Components and Technology Conference, San Diego, California, pp.718-727, May 30-June 2, 2006. 

  42. Temperature and Time-Dependent Property Prediction and Validation for Nano-Underfills using RSA based RVE Algorithms, Lall, P., Islam, S., Suhling, J., Tian, G., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.906-920, May 30-June 2, 2006. 

  43. Effects of Aging on the Stress-Strain and Creep Behaviors of Lead Free Solders, Ma, H., Suhling, J. C., Lall, P., Bozack, M. J., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.961-976, May 30-June 2, 2006. 

  44. Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components, Lall, P., Panchagade, D., Iyengar, D., Suhling, J., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.804-816, May 30-June 2, 2006. 

  45. Material Behavior Changes in Underfill Encapsulants Exposed to Isothermal Aging, Lin, C., Islam, S., Suhling, J. C., Lall, P., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.1137-1146, May 30-June 2, 2006. 

  46. Reliability of Flip Chip Assemblies Subjected to Extreme Low Temperatures, Rahim, M. K., Suhling, J. C., Jaeger, R. C., Lall, P., Knight, R., Strickland, M., Blanche, J., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.1379-1389, May 30-June 2, 2006. 

  47. Reliability and Die Stress Measurements in Flip Chip Assemblies with Carbon Fiber Core Laminate Substrates, Copeland, D. S., Rahim, M. K., Suhling, J. C., Jaeger, R. C., Lall, P., Vasoya, K., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.997-1010, May 30-June 2, 2006. 

  48. Degradation of Thermal Performance of Ball Grid Arrays after Thermal Cycling, Knight, R., Elkady, Y., Suhling, J. C., Lall, P., Proceedings of the ITherm 2006, 10th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, San Diego, California, pp.833-841, May 30-June 2, 2006. 

  49. Damage Mechanics of Electronics on Metal-Backed Substrates in Harsh Environments, Lall, P., Islam, M. N., Suhling, J., IEEE Transactions on Components and Packaging Technologies, Vol. 29, Number 1, pp. 204-212, March 2006. 

  50. Thermal Reliability Considerations for Deployment of Area Array Packages in Harsh Environments, Lall, P., Singh, N., Suhling, J., Strickland, M., Blanche, J., IEEE Transactions on Components and Packaging Technologies, Vol. 28, Number 3, pp. 457-466, September 2005.

  51. Measurement of the Temperature Dependent Constitutive Behavior of Underfill Encapsulants, M. S. Islam, J. Suhling, P. Lall, IEEE Transactions on Components and Packaging Technologies, Vol. 28, Number 3, pp. 467-476, September 2005. 

  52. Die Stress Characterization in Flip Chip on Laminate Assemblies, Rahim, M. K., J. Suhling, D. S. Copeland, M. S. Islam, R. Jaeger, P. Lall, R. W. Johnson, IEEE Transactions on Components and Packaging Technologies, Vol. 28, Number 3, pp. 415-429, September 2005. 

  53. Corner Bonding of CSPs: Processing and Reliability, Tian, G., Liu, Y., Johnson, W., Lall, P., Palmer, M., Islam, M. N., IEEE Transactions on Electronic Packaging Manufacturing, Vol. 28, Number 3, pp. 231-240, July 2005. 

  54. Prognostication and Health Monitoring of Leaded and Lead Free Electronic and MEMS Packages in Harsh Environments, Lall, P., Islam, N., Suhling, J., Proceedings of the IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 1305 - 1313, June 1 - 3, 2005.

  55. Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments, Lall, P., Singh, N., Strickland, M., Blanche, J., Suhling, J., Proceedings of the IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 127 - 136, June 1 - 3, 2005.

  56. Fundamentals of Delamination Initiation and Growth in Flip Chip Assemblies, M. K. Rahim, J. C. Suhling, R. C. Jaeger, and P. Lall, Proceedings of the IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 1172 - 1186, June 1 - 3, 2005.

  57. Material Characterization and Die Stress Measurement of Low Expansion PCB for Extreme Environments, D. S. Copeland, M. K. Rahim, M. S. Islam, J. C. Suhling, R. C. Jaeger, P. Lall, G. Tian, K. Vasoya, Proceedings of the IEEE Aerospace Conference, Big Sky, MT, March 5 - 12, 2005.

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